Inventor · disambiguated record
Curtis Zwenger
Also filed as: ZWENGER CURTIS M · ZWENGER CURTIS MICHAEL · Zwenger Curtis
48 granted patents·8 pending applications·379 citations·filing 2003–2024
98Inventor score
Files withAMKOR TECHNOLOGY INC29AMKOR TECH SINGAPORE HOLDING PTE LTD21YOSHIDA AKITO3SMITH LEE J1ZWENGER CURTIS MICHAEL1
Top patents by PatentIndex Score
56 records- 0198US9012789B1Stackable via package and methodAMKOR TECHNOLOGY INC·Filed 2014·Granted Apr 21, 2015·31 cites·20 claims
- 0298US8222538B1Stackable via package and methodYOSHIDA AKITO·Filed 2009·Granted Jul 17, 2012·91 cites·20 claims
- 0397US10256114B2Semiconductor device with tiered pillar and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Apr 9, 2019·16 cites·16 claims
- 0497US9960328B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted May 1, 2018·20 cites·18 claims
- 0596US9559075B1Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jan 31, 2017·20 cites·20 claims
- 0695US10410999B2Semiconductor device with integrated heat distribution and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Sep 10, 2019·14 cites·18 claims
- 0795US9730327B1Stackable via package and methodAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 8, 2017·10 cites·20 claims
- 0895US8704368B1Stackable via package and methodYOSHIDA AKITO·Filed 2012·Granted Apr 22, 2014·15 cites·16 claims
- 0995US8623753B1Stackable protruding via package and methodYOSHIDA AKITO·Filed 2009·Granted Jan 7, 2014·41 cites·21 claims
- 1093US10206285B1Stackable via package and methodAMKOR TECHNOLOGY INC·Filed 2018·Granted Feb 12, 2019·5 cites·20 claims
- 1193US9905440B1Method of manufacturing an electronic device and electronic device manufactured therebyAMKOR TECHNOLOGY INC·Filed 2016·Granted Feb 27, 2018·8 cites·20 claims
- 1292US10008393B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jun 26, 2018·7 cites·22 claims
- 1391US10504827B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Dec 10, 2019·6 cites·7 claims
- 1490US11031256B2Semiconductor device with tiered pillar and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jun 8, 2021·2 cites·19 claims
- 1589US10034372B1Stackable via package and methodAMKOR TECHNOLOGY INC·Filed 2017·Granted Jul 24, 2018·3 cites·20 claims
- 1687US10490716B2Semiconductor device with optically-transmissive layer and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Nov 26, 2019·3 cites·10 claims
- 1786US11823913B2Method of manufacturing an electronic device and electronic device manufactured therebyAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Nov 21, 2023·1 cites·20 claims
- 1885US12035472B2Stackable via package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jul 9, 2024·0 cites·20 claims
- 1985US11901343B2Semiconductor device with integrated heat distribution and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Feb 13, 2024·1 cites·20 claims
- 2085US10784422B2Semiconductor device with optically-transmissive layer and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2019·Granted Sep 22, 2020·2 cites·20 claims
- 2185US9576917B1Embedded die in panel method and structureAMKOR TECHNOLOGY INC·Filed 2013·Granted Feb 21, 2017·7 cites·20 claims
- 2285US2024387785A1Semiconductor device with transmissive layer and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 2384US11437552B2Semiconductor device with transmissive layer and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Sep 6, 2022·1 cites·20 claims
- 2484US11031259B2Method of manufacturing an electronic device and electronic device manufactured therebyAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Jun 8, 2021·2 cites·20 claims
- 2584US6998702B1Front edge chamfer feature for fully-molded memory cardsAMKOR TECHNOLOGY INC·Filed 2003·Granted Feb 14, 2006·25 cites·15 claims
- 2684US2024332032A1Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 2783US11444013B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Sep 13, 2022·2 cites·20 claims
- 2883US10748786B2Semiconductor device with tiered pillar and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2019·Granted Aug 18, 2020·2 cites·17 claims
- 2982US10468272B2Method of manufacturing an electronic device and electronic device manufactured therebyAMKOR TECHNOLOGY INC·Filed 2018·Granted Nov 5, 2019·2 cites·20 claims
- 3082US2024087914A1Method of manufacturing an electronic device and electronic device manufactured therebyAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 3180US11942581B2Semiconductor device with transmissive layer and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Mar 26, 2024·0 cites·20 claims
- 3280US2024290761A1Semiconductor device with integrated heat distribution and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 3379US10438910B2Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Oct 8, 2019·2 cites·20 claims
- 3477US11700692B2Stackable via package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jul 11, 2023·0 cites·22 claims
- 3575US11948808B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Apr 2, 2024·0 cites·18 claims
- 3674US11089685B2Stackable via package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 10, 2021·0 cites·20 claims
- 3773US12183594B2Semiconductor device with tiered pillar and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Dec 31, 2024·0 cites·20 claims
- 3872US12015000B2Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
- 3970US11195726B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Dec 7, 2021·0 cites·13 claims
- 4069US9741617B2Encapsulated semiconductor package and method of manufacturing thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 22, 2017·1 cites·20 claims
- 4167US10548221B1Stackable via package and methodAMKOR TECHNOLOGY INC·Filed 2019·Granted Jan 28, 2020·0 cites·20 claims
- 4266US6897550B1Fully-molded leadframe stand-off featureAMKOR TECHNOLOGY INC·Filed 2003·Granted May 24, 2005·14 cites·20 claims
- 4365US9367712B1High density memory card using folded flexSMITH LEE J·Filed 2007·Granted Jun 14, 2016·3 cites·20 claims
- 4462US11018102B2Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 4562US10985146B2Semiconductor device with integrated heat distribution and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 4660US10553451B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Feb 4, 2020·0 cites·19 claims
- 4760US7193305B1Memory card ESC substrate insertAMKOR TECHNOLOGY INC·Filed 2004·Granted Mar 20, 2007·10 cites·19 claims
- 4859US2021217631A1Electronic device with adaptive vertical interconnect and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Application pending·0 cites
- 4957US7556986B1Tape supported memory card leadframe structureAMKOR TECHNOLOGY INC·Filed 2006·Granted Jul 7, 2009·1 cites·20 claims
- 5056US10062611B2Encapsulated semiconductor package and method of manufacturing thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Aug 28, 2018·0 cites·20 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
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