Inventor · disambiguated record
Aaron R. Fellis
Also filed as: FELLIS AARON · FELLIS AARON R
12 granted patents·1 pending application·1,694 citations·filing 2003–2022
94Inventor score
Top patents by PatentIndex Score
13 records- 0198US10347547B2Suppressing interfacial reactions by varying the wafer temperature throughout depositionLAM RES CORP·Filed 2016·Granted Jul 9, 2019·401 cites·20 claims
- 0298US8435894B2Depositing tungsten into high aspect ratio featuresCHANDRASHEKAR ANAND·Filed 2012·Granted May 7, 2013·314 cites·13 claims
- 0397US9362163B2Methods and apparatuses for atomic layer cleaning of contacts and viasLAM RES CORP·Filed 2014·Granted Jun 7, 2016·109 cites·17 claims
- 0497US8835317B2Depositing tungsten into high aspect ratio featuresNOVELLUS SYSTEMS INC·Filed 2013·Granted Sep 16, 2014·33 cites·23 claims
- 0597US8124531B2Depositing tungsten into high aspect ratio featuresCHANDRASHEKAR ANAND·Filed 2011·Granted Feb 28, 2012·64 cites·20 claims
- 0697US7141494B2Method for reducing tungsten film roughness and improving step coverageNOVELLUS SYSTEMS INC·Filed 2003·Granted Nov 28, 2006·147 cites·32 claims
- 0796US9034768B2Depositing tungsten into high aspect ratio featuresCHANDRASHEKAR ANAND·Filed 2010·Granted May 19, 2015·32 cites·21 claims
- 0895US8709948B2Tungsten barrier and seed for copper filled TSVDANEK MICHAL·Filed 2010·Granted Apr 29, 2014·36 cites·25 claims
- 0995US8119527B1Depositing tungsten into high aspect ratio featuresCHADRASHEKAR ANAND·Filed 2009·Granted Feb 21, 2012·452 cites·19 claims
- 1095US7262125B2Method of forming low-resistivity tungsten interconnectsNOVELLUS SYSTEMS INC·Filed 2004·Granted Aug 28, 2007·91 cites·32 claims
- 1192US8617982B2Subtractive patterning to define circuit componentsDANEK MICHAL·Filed 2011·Granted Dec 31, 2013·15 cites·17 claims
- 1261US11075127B2Suppressing interfacial reactions by varying the wafer temperature throughout depositionLAM RES CORP·Filed 2019·Granted Jul 27, 2021·0 cites·20 claims
- 1353US2025062118A1High pressure plasma inhibitionLAM RES CORP·Filed 2022·Application pending·0 cites
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