Inventor · disambiguated record
Randy Hoffman
Also filed as: HOFFMAN RANDY · HOFFMAN RANDY L
58 granted patents·15 pending applications·14,929 citations·filing 2002–2020
99Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO40HOFFMAN RANDY8HERMAN GREGORY4HOFFMAN RANDY L4HERMAN GREGORY S3
Top patents by PatentIndex Score
73 records- 0199US7732251B2Method of making a semiconductor device having a multicomponent oxideHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Jun 8, 2010·266 cites·18 claims
- 0299US7462862B2Transistor using an isovalent semiconductor oxide as the active channel layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Dec 9, 2008·3.9k cites·30 claims
- 0399US7339187B2Transistor structuresOREGON STATE·Filed 2003·Granted Mar 4, 2008·328 cites·57 claims
- 0499US7297977B2Semiconductor deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Nov 20, 2007·4.2k cites·32 claims
- 0599US7282782B2Combined binary oxide semiconductor deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Oct 16, 2007·4.1k cites·38 claims
- 0699US7189992B2Transistor structures having a transparent channelOREGON STATE·Filed 2002·Granted Mar 13, 2007·319 cites·80 claims
- 0798US8647031B2Method of making a semiconductor device having a multicomponent oxideHOFFMAN RANDY L·Filed 2012·Granted Feb 11, 2014·149 cites·20 claims
- 0898US8203144B2Semiconductor device having a metal oxide channelHOFFMAN RANDY L·Filed 2010·Granted Jun 19, 2012·172 cites·8 claims
- 0998US7888207B2Transistor structures and methods for making the sameOREGON STATE·Filed 2007·Granted Feb 15, 2011·145 cites·26 claims
- 1097US7838348B2Semiconductor deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2009·Granted Nov 23, 2010·47 cites·27 claims
- 1197US7564055B2Transistor including a deposited channel region having a doped portionHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Jul 21, 2009·62 cites·23 claims
- 1297US7262463B2Transistor including a deposited channel region having a doped portionHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Aug 28, 2007·150 cites·3 claims
- 1397US7145174B2Semiconductor deviceUNIV OREGON·Filed 2004·Granted Dec 5, 2006·218 cites·17 claims
- 1496US7382421B2Thin film transistor with a passivation layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jun 3, 2008·187 cites·26 claims
- 1596US7309895B2Semiconductor deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Dec 18, 2007·41 cites·34 claims
- 1695US7626201B2Semiconductor deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Dec 1, 2009·36 cites·20 claims
- 1794US7547591B2Semiconductor deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Jun 16, 2009·25 cites·21 claims
- 1894US7242039B2Semiconductor deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jul 10, 2007·78 cites·46 claims
- 1993US7642573B2Semiconductor deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jan 5, 2010·61 cites·30 claims
- 2093US7629191B2Semiconductor deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Dec 8, 2009·25 cites·20 claims
- 2191US7250930B2Transparent active-matrix displayHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jul 31, 2007·74 cites·17 claims
- 2291US7026713B2Transistor device having a delafossite materialHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Apr 11, 2006·53 cites·36 claims
- 2390US7374984B2Method of forming a thin film componentHOFFMAN RANDY·Filed 2004·Granted May 20, 2008·56 cites·26 claims
- 2489US7427776B2Thin-film transistor and methodsHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Sep 23, 2008·51 cites·70 claims
- 2589US7329915B2Rectifying contact to an n-type oxide material or a substantially insulating oxide materialHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Feb 12, 2008·14 cites·35 claims
- 2689US7285501B2Method of forming a solution processed deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Oct 23, 2007·38 cites·29 claims
- 2786US9636902B2Film stack including adhesive layerHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2013·Granted May 2, 2017·4 cites·13 claims
- 2886US8828570B2Battery temperature sensorBANERJEE NEEL·Filed 2011·Granted Sep 9, 2014·7 cites·19 claims
- 2985US8587093B2Multilayer device with organic and inorganic dielectric materialMARDILOVICH PETER·Filed 2007·Granted Nov 19, 2013·8 cites·14 claims
- 3080US7381658B2Encapsulation of nano-dimensional structures by oxidationHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jun 3, 2008·12 cites·24 claims
- 3178US9651407B2Configurable sensor arraysMOUREY DEVIN ALEXANDER·Filed 2011·Granted May 16, 2017·3 cites·11 claims
- 3277US8822988B2Thin-film transistor (TFT) with a bi-layer channelKORTHUIS VINCENT C·Filed 2009·Granted Sep 2, 2014·7 cites·9 claims
- 3375US7250627B2Semiconductor deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jul 31, 2007·18 cites·21 claims
- 3474US7132319B2Transparent double-injection field-effect transistorHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Nov 7, 2006·4 cites·14 claims
- 3571US8314420B2Semiconductor device with multiple component oxide channelHOFFMAN RANDY L·Filed 2004·Granted Nov 20, 2012·16 cites·31 claims
- 3670US7265003B2Method of forming a transistor having a dual layer dielectricHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Sep 4, 2007·12 cites·47 claims
- 3769US7151338B2Inorganic electroluminescent device with controlled hole and electron injectionHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Dec 19, 2006·10 cites·39 claims
- 3866US8669553B2Thin film transistorsKNUTSON CHRIS·Filed 2010·Granted Mar 11, 2014·4 cites·17 claims
- 3965US7772049B2Semiconductor deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Aug 10, 2010·2 cites·16 claims
- 4063US11433670B2Conductive elements electrically coupled to fluidic diesHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Sep 6, 2022·0 cites·15 claims
- 4160US7915651B2Transparent double-injection field-effect transistorHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Mar 29, 2011·1 cites·5 claims
- 4259US11279130B2Fluidic dies with conductive membersHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Mar 22, 2022·0 cites·15 claims
- 4359US8969865B2Semiconductor film compositionHERMAN GREGORY·Filed 2006·Granted Mar 3, 2015·1 cites·7 claims
- 4459US8058096B2Microelectronic deviceHERMAN GREGORY·Filed 2007·Granted Nov 15, 2011·2 cites·15 claims
- 4556US7265063B2Method of forming a component having dielectric sub-layersHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Sep 4, 2007·4 cites·33 claims
- 4654US8143706B2Method of forming a component having dielectric sub-layersMARDILOVICH PETER·Filed 2007·Granted Mar 27, 2012·0 cites·10 claims
- 4751US7799624B2Method of forming a thin film componentHEWLETT PACKARD DEVELOPMENT CO·Filed 2008·Granted Sep 21, 2010·0 cites·11 claims
- 4851US7768080B2Multilayer dielectricHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Aug 3, 2010·0 cites·20 claims
- 4950US8823100B2Semiconductor devices and methods of makingHERMAN GREGORY·Filed 2007·Granted Sep 2, 2014·0 cites·26 claims
- 5049US8101947B2System and method for manufacturing a thin-film deviceHOFFMAN RANDY·Filed 2007·Granted Jan 24, 2012·0 cites·16 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
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