Inventor · disambiguated record
Moriji Matsumoto
Also filed as: MATSUMOTO MORIJI
10 granted patents·9 pending applications·452 citations·filing 2001–2007
91Inventor score
Top patents by PatentIndex Score
19 records- 0198US6717189B2Electroless plating liquid and semiconductor deviceEBARA CORP·Filed 2001·Granted Apr 6, 2004·314 cites·9 claims
- 0292US6689257B2Substrate processing apparatus and substrate plating apparatusEBARA CORP·Filed 2001·Granted Feb 10, 2004·54 cites·12 claims
- 0389US7279408B2Semiconductor device, method for manufacturing the same, and plating solutionEBARA CORP·Filed 2005·Granted Oct 9, 2007·13 cites·10 claims
- 0483US7060618B2Semiconductor device, method for manufacturing the same, and plating solutionEBARA CORP·Filed 2002·Granted Jun 13, 2006·24 cites·6 claims
- 0580US6706422B2Electroless Ni—B plating liquid, electronic device and method for manufacturing the sameEBARA CORP·Filed 2001·Granted Mar 16, 2004·16 cites·7 claims
- 0668US7208074B2Substrate processing apparatus and substrate plating apparatusEBARA CORP·Filed 2003·Granted Apr 24, 2007·9 cites·3 claims
- 0767US6821902B2Electroless plating liquid and semiconductor deviceEBARA CORP·Filed 2004·Granted Nov 23, 2004·9 cites·11 claims
- 0861US6858084B2Plating apparatus and methodEBARA CORP·Filed 2001·Granted Feb 22, 2005·6 cites·8 claims
- 0958US6936302B2Electroless Ni-B plating liquid, electronic device and method for manufacturing the sameTOSHIBA KK·Filed 2004·Granted Aug 30, 2005·2 cites·6 claims
- 1055US7344986B2Plating solution, semiconductor device and method for manufacturing the sameEBARA CORP·Filed 2002·Granted Mar 18, 2008·5 cites·5 claims
- 1153US2008011228A1Semiconductor device, method for manufacturing the same, and plating solutionINOUE HIROAKI·Filed 2007·Application pending·0 cites
- 1244US2005074559A1Plating apparatus and methodFiled 2004·Application pending·0 cites
- 1344US2006027452A1Substrate processing apparatus and substrate plating apparatusMISHIMA KOJI·Filed 2005·Application pending·0 cites
- 1437US2002090814A1Method for forming interconnects and semiconductor deviceFiled 2001·Application pending·0 cites
- 1537US2004170766A1Electroless plating method and device, and substrate processing method and apparatusFiled 2002·Application pending·0 cites
- 1637US2004235237A1Semiconductor device and method for manufacturing the sameFiled 2002·Application pending·0 cites
- 1737US2005282384A1Method for forming protective film and electroless plating bathNAWAFUNE HIDEMI·Filed 2004·Application pending·0 cites
- 1837US2004186008A1Catalyst-imparting treatment solution and electroless plating methodFiled 2002·Application pending·0 cites
- 1936US2001024691A1Semiconductor substrate processing apparatus and methodFiled 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →