Inventor · disambiguated record
Mieko Suzuki
Also filed as: SUZUKI MIEKO
15 granted patents·485 citations·filing 1983–2005
93Inventor score
Top patents by PatentIndex Score
15 records- 0196US5420075AForming multi-layered interconnections with fluorine compound treatment permitting selective deposition of insulatorNEC CORP·Filed 1993·Granted May 30, 1995·293 cites·14 claims
- 0273US4552633AFine particulate for use in clinical testing and a process for producing thereofJAPAN ATOMIC ENERGY RES INST·Filed 1983·Granted Nov 12, 1985·26 cites·15 claims
- 0368US5607880AMethod of fabricating multilevel interconnections in a semiconductor integrated circuitNEC CORP·Filed 1993·Granted Mar 4, 1997·40 cites·37 claims
- 0462US6551914B1Method of forming polish stop by plasma treatment for interconnectionNEC ELECTRONICS CORP·Filed 2000·Granted Apr 22, 2003·11 cites·10 claims
- 0558US6361708B1Method and apparatus for polishing a metal filmNEC CORP·Filed 1998·Granted Mar 26, 2002·22 cites·6 claims
- 0658US5332694AProcess for manufacturing a semiconductor deviceNEC CORP·Filed 1993·Granted Jul 26, 1994·27 cites·11 claims
- 0752US7123336B2Twisted nematic liquid crystal material with certain values for dielectric constant anisotropy, twisted elasticity modulus and refractive index anisotropySONY CORP·Filed 2003·Granted Oct 17, 2006·2 cites·6 claims
- 0851US5491108AMethod of producing semiconductor integrated circuit device having interplayer insulating film covering substrateNEC CORP·Filed 1993·Granted Feb 13, 1996·20 cites·6 claims
- 0950US7167229B2Liquid crystal display element and projection display deviceSONY CORP·Filed 2005·Granted Jan 23, 2007·0 cites·5 claims
- 1049US6235071B1Chemical mechanical polishing method for highly accurate in-plane uniformity in polishing rate over positionNEC CORP·Filed 1999·Granted May 22, 2001·14 cites·6 claims
- 1148US6951512B2Chemical mechanical polishing apparatus and method of chemical mechanical polishingNEC ELECTRONICS CORP·Filed 2004·Granted Oct 4, 2005·1 cites·15 claims
- 1244US5904558AFabrication process of semiconductor deviceNEC CORP·Filed 1997·Granted May 18, 1999·11 cites·20 claims
- 1342US6054383AFabrication method of semiconductor deviceNEC CORP·Filed 1996·Granted Apr 25, 2000·11 cites·11 claims
- 1439US6783446B1Chemical mechanical polishing apparatus and method of chemical mechanical polishingNEC ELECTRONICS CORP·Filed 1999·Granted Aug 31, 2004·6 cites·19 claims
- 1530US6110014AMethod and apparatus polishing wafer for extended effective area of waferNEC CORP·Filed 1998·Granted Aug 29, 2000·1 cites·16 claims
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