Inventor · disambiguated record
Sundar M. Kamath
Also filed as: KAMATH SUNDAR · KAMATH SUNDAR M · KAMATH SUNDAR MANGALORE
13 granted patents·506 citations·filing 1997–2004
94Inventor score
Top patents by PatentIndex Score
13 records- 0189US6136419ACeramic substrate having a sealed layerIBM·Filed 1999·Granted Oct 24, 2000·74 cites·29 claims
- 0289US6037044ADirect deposit thin film single/multi chip moduleIBM·Filed 1998·Granted Mar 14, 2000·68 cites·24 claims
- 0387US6312791B1Multilayer ceramic substrate with anchored padIBM·Filed 2000·Granted Nov 6, 2001·36 cites·19 claims
- 0487US6139666AMethod for producing ceramic surfaces with easily removable contact sheetsIBM·Filed 1999·Granted Oct 31, 2000·88 cites·7 claims
- 0581US5976710ALow TCE polyimides as improved insulator in multilayer interconnect structuresIBM·Filed 1997·Granted Nov 2, 1999·72 cites·31 claims
- 0680US6187418B1Multilayer ceramic substrate with anchored padIBM·Filed 1999·Granted Feb 13, 2001·40 cites·35 claims
- 0776US6509529B2Isolated flip chip of BGA to minimize interconnect stress due to thermal mismatchKULICKE & SOFFA HOLDINGS INC·Filed 2001·Granted Jan 21, 2003·17 cites·16 claims
- 0872US6261467B1Direct deposit thin film single/multi chip moduleIBM·Filed 1999·Granted Jul 17, 2001·26 cites·11 claims
- 0970US6317331B1Wiring substrate with thermal insertKULICKE & SOFFA HOLDINGS INC·Filed 1999·Granted Nov 13, 2001·37 cites·14 claims
- 1062US6964885B2Stress resistant land grid array (LGA) module and method of forming the sameIBM·Filed 2004·Granted Nov 15, 2005·9 cites·33 claims
- 1158US6703560B2Stress resistant land grid array (LGA) module and method of forming the sameIBM·Filed 2001·Granted Mar 9, 2004·7 cites·7 claims
- 1255US6299053B1Isolated flip chip or BGA to minimize interconnect stress due to thermal mismatchKULICKE & SOFFA HOLDINGS INC·Filed 1999·Granted Oct 9, 2001·14 cites·4 claims
- 1352US6258191B1Method and materials for increasing the strength of crystalline ceramicIBM·Filed 1998·Granted Jul 10, 2001·18 cites·7 claims
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