Inventor · disambiguated record
David F. Abdo
Also filed as: ABDO DAVID · ABDO DAVID F
19 granted patents·2 pending applications·172 citations·filing 1999–2020
94Inventor score
Files withFREESCALE SEMICONDUCTOR INC9NXP USA INC7ABDO DAVID F2LAKSHMINARAYAN VISWANATHAN1MOTOROLA INC1
Top patents by PatentIndex Score
21 records- 0197US10269678B1Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereofNXP USA INC·Filed 2017·Granted Apr 23, 2019·31 cites·16 claims
- 0294US9922894B1Air cavity packages and methods for the production thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Mar 20, 2018·15 cites·14 claims
- 0392US7445967B2Method of packaging a semiconductor die and package thereofFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Nov 4, 2008·23 cites·20 claims
- 0491US9111984B2Devices and methods of operation for separating semiconductor die from adhesive tapeFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Aug 18, 2015·18 cites·17 claims
- 0591US9099567B2Packaged semiconductor devices and methods of their fabricationVISWANATHAN LAKSHMINARAYAN·Filed 2013·Granted Aug 4, 2015·13 cites·25 claims
- 0689US10075132B2RF amplifier with conductor-less region underlying filter circuit inductor, and methods of manufacture thereofFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Sep 11, 2018·5 cites·33 claims
- 0786US8535982B1Providing an automatic optical inspection feature for solder joints on semiconductor packagesABDO DAVID F·Filed 2012·Granted Sep 17, 2013·17 cites·20 claims
- 0879US10741446B2Method of wafer dicing for wafers with backside metallization and packaged diesNXP USA INC·Filed 2017·Granted Aug 11, 2020·2 cites·20 claims
- 0978US10861764B2Microelectronic components having integrated heat dissipation posts and systems including the sameNXP USA INC·Filed 2019·Granted Dec 8, 2020·2 cites·20 claims
- 1075US9425161B2Semiconductor device with mechanical lock features between a semiconductor die and a substrateFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Aug 23, 2016·2 cites·19 claims
- 1174US10630246B2Methods of manufacturing encapsulated semiconductor device package with heatsink openingNXP USA INC·Filed 2017·Granted Apr 21, 2020·2 cites·20 claims
- 1270US6072238ASemiconductor componentMOTOROLA INC·Filed 1999·Granted Jun 6, 2000·38 cites·14 claims
- 1366US9349693B2Semiconductor device with an isolation structure coupled to a cover of the semiconductor deviceLAKSHMINARAYAN VISWANATHAN·Filed 2014·Granted May 24, 2016·3 cites·18 claims
- 1465US9787254B2Encapsulated semiconductor device package with heatsink opening, and methods of manufacture thereofFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Oct 10, 2017·1 cites·10 claims
- 1562US11437276B2Packaged dies with metal outer layers extending from die back sides toward die front sidesNXP USA INC·Filed 2020·Granted Sep 6, 2022·0 cites·20 claims
- 1653US10637400B2RF amplifier with conductor-less region underlying filter circuit inductor, and methods of manufacture thereofNXP USA INC·Filed 2018·Granted Apr 28, 2020·0 cites·21 claims
- 1751US10109594B2Semiconductor device with an isolation structure coupled to a cover of the semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Oct 23, 2018·0 cites·13 claims
- 1851US2009023248A1Method of packaging a semiconductor dieFREESCALE SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 1941US9893027B2Pre-plated substrate for die attachmentFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Feb 13, 2018·0 cites·9 claims
- 2040US2018012855A1Pre-plated substrate for die attachmentNXP USA INC·Filed 2017·Application pending·0 cites
- 2139US8318545B2Method of making a mounted gallium nitride deviceABDO DAVID F·Filed 2010·Granted Nov 27, 2012·0 cites·14 claims
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