Inventor · disambiguated record
Zhiyong Ma
Also filed as: MA ZHIYONG
10 granted patents·2 pending applications·75 citations·filing 2001–2022
86Inventor score
Top patents by PatentIndex Score
12 records- 0184US6703069B1Under bump metallurgy for lead-tin bump over copper padINTEL CORP·Filed 2002·Granted Mar 9, 2004·33 cites·6 claims
- 0276US6878465B2Under bump metallurgy for Lead-Tin bump over copper padINTEL CORP·Filed 2003·Granted Apr 12, 2005·19 cites·9 claims
- 0363US8242831B2Tamper resistant fuse designTONG XIANGHONG·Filed 2009·Granted Aug 14, 2012·3 cites·20 claims
- 0463US6740427B2Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making sameINTEL CORP·Filed 2001·Granted May 25, 2004·13 cites·25 claims
- 0561US9123724B2Methods of forming secured metal gate antifuse structuresINTEL CORP·Filed 2013·Granted Sep 1, 2015·1 cites·9 claims
- 0657US8618613B2Methods of forming secured metal gate antifuse structuresTONG XIANGHONG·Filed 2011·Granted Dec 31, 2013·1 cites·19 claims
- 0755US12431327B2Stroboscopic electron-beam signal image mappingINTEL CORP·Filed 2022·Granted Sep 30, 2025·0 cites·22 claims
- 0851US7679145B2Transistor performance enhancement using engineered strainsINTEL CORP·Filed 2004·Granted Mar 16, 2010·5 cites·21 claims
- 0945US12234611B2Wall-cloth with a laminated core coated through infiltration and a method for preparing the sameSUZHOU HONGNI NEW MATERIAL TECH LTD CO·Filed 2018·Granted Feb 25, 2025·0 cites·8 claims
- 1044US2023305057A1Wafer level electron beam proberINTEL CORP·Filed 2022·Application pending·0 cites
- 1140US11749560B2Cladded metal interconnectsINTEL CORP·Filed 2018·Granted Sep 5, 2023·0 cites·19 claims
- 1234US2018145083A1Controlled modification of antifuse programming voltageINTEL CORP·Filed 2015·Application pending·0 cites
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