Inventor · disambiguated record
Jeremy S. Frei
Also filed as: FREI JEREMY S
13 granted patents·2 pending applications·21 citations·filing 2011–2024
88Inventor score
Top patents by PatentIndex Score
15 records- 0189US9059380B2Discontinuous patterned bonds for semiconductor devices and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Jun 16, 2015·6 cites·18 claims
- 0288US8598611B2Vertical solid-state transducers and solid-state transducer arrays having backside terminals and associated systems and methodsODNOBLYUDOV VLADIMIR·Filed 2012·Granted Dec 3, 2013·6 cites·30 claims
- 0387US12394765B2Discontinuous patterned bonds for semiconductor devices and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2024·Granted Aug 19, 2025·0 cites·18 claims
- 0487US2025056937A1Etched trenches in bond materials for die singulation, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0582US10242970B2Discontinuous patterned bonds for semiconductor devices and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Mar 26, 2019·2 cites·16 claims
- 0682US8754424B2Discontinuous patterned bonds for semiconductor devices and associated systems and methodsSCHELLHAMMER SCOTT D·Filed 2011·Granted Jun 17, 2014·4 cites·10 claims
- 0781US9362259B2Discontinuous patterned bonds for semiconductor devices and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Jun 7, 2016·2 cites·20 claims
- 0878US11901342B2Discontinuous patterned bonds for semiconductor devices and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 13, 2024·0 cites·19 claims
- 0974US10892384B2Etched trenches in bond materials for die singulation, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Jan 12, 2021·1 cites·12 claims
- 1073US12132155B2Etched trenches in bond materials for die singulation, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 29, 2024·0 cites·20 claims
- 1165US11222874B2Discontinuous patterned bonds for semiconductor devices and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Jan 11, 2022·0 cites·18 claims
- 1254US10020432B2Etched trenches in bond materials for die singulation, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Jul 10, 2018·0 cites·10 claims
- 1353US8952413B2Etched trenches in bond materials for die singulation, and associated systems and methodsODNOBLYUDOV VLADIMIR·Filed 2012·Granted Feb 10, 2015·0 cites·6 claims
- 1443US2015048301A1Engineered substrates having mechanically weak structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2013·Application pending·0 cites
- 1537US9230847B2Engineered substrate assemblies with thermally opaque materials, and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2013·Granted Jan 5, 2016·0 cites·13 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →