Inventor · disambiguated record
Chung-Hsing Liao
Also filed as: LIAO CHUNG-HSING
4 granted patents·1 pending application·15 citations·filing 2013–2024
64Inventor score
Files withBOARDTEK ELECTRONICS CORP5
Top patents by PatentIndex Score
5 records- 0191US9860990B1Circuit board structure with chips embedded therein and manufacturing method thereofBOARDTEK ELECTRONICS CORP·Filed 2016·Granted Jan 2, 2018·14 cites·7 claims
- 0261US9271387B2Circuit board structure manufacturing methodBOARDTEK ELECTRONICS CORP·Filed 2013·Granted Feb 23, 2016·1 cites·11 claims
- 0353US2025358936A1Circuit board with embedded elements and method for fabricating the sameBOARDTEK ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0443US12074357B2Electromagnetic wave transmission board comprising an inner board with a plated through hole covered by outer plates, where the electromagnetic waves propagate in the through hole without leakageBOARDTEK ELECTRONICS CORP·Filed 2021·Granted Aug 27, 2024·0 cites·19 claims
- 0541US11129283B2Method of electroplating a circuit boardBOARDTEK ELECTRONICS CORP·Filed 2019·Granted Sep 21, 2021·0 cites·11 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →