Inventor · disambiguated record
Akihiko Ariga
Also filed as: ARIGA AKIHIKO
15 granted patents·1 pending application·254 citations·filing 1998–2009
94Inventor score
Top patents by PatentIndex Score
16 records- 0189US6507204B1Semiconductor testing equipment with probe formed on a cantilever of a substrateHITACHI LTD·Filed 2000·Granted Jan 14, 2003·40 cites·14 claims
- 0289US6305230B1Connector and probing systemHITACHI LTD·Filed 1998·Granted Oct 23, 2001·79 cites·14 claims
- 0379US6455335B1Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 2000·Granted Sep 24, 2002·17 cites·10 claims
- 0477US6566150B2Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 2002·Granted May 20, 2003·15 cites·1 claims
- 0577US6531327B2Method for manufacturing semiconductor device utilizing semiconductor testing equipmentHITACHI LTD·Filed 2002·Granted Mar 11, 2003·17 cites·21 claims
- 0676US6759258B2Connection device and test systemRENESAS TECH CORP·Filed 2001·Granted Jul 6, 2004·14 cites·17 claims
- 0764US7541202B2Connection device and test systemRENESAS TECH CORP·Filed 2007·Granted Jun 2, 2009·1 cites·10 claims
- 0860US6573112B2Semiconductor device manufacturing methodHITACHI LTD·Filed 2002·Granted Jun 3, 2003·6 cites·10 claims
- 0959US6566149B1Method for manufacturing substrate for inspecting semiconductor deviceHITACHI LTD·Filed 1998·Granted May 20, 2003·22 cites·14 claims
- 1054US7285430B2Connection device and test systemHITACHI LTD·Filed 2004·Granted Oct 23, 2007·3 cites·8 claims
- 1154US6511857B1Process for manufacturing semiconductor deviceHITACHI LTD·Filed 1999·Granted Jan 28, 2003·15 cites·18 claims
- 1253US6197603B1Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 1998·Granted Mar 6, 2001·12 cites·4 claims
- 1352US2009209053A1Connection device and test systemKASUKABE SUSUMU·Filed 2009·Application pending·0 cites
- 1450US7198962B2Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 2003·Granted Apr 3, 2007·3 cites·5 claims
- 1545US6479305B2Semiconductor device manufacturing methodHITACHI LTD·Filed 1999·Granted Nov 12, 2002·10 cites·13 claims
- 1639US7119362B2Method of manufacturing semiconductor apparatusRENESAS TECH CORP·Filed 2002·Granted Oct 10, 2006·0 cites·11 claims
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