Inventor · disambiguated record
Chang-Han Shim
Also filed as: SHIM CHANG H · SHIM CHANG-HAN
5 granted patents·2 pending applications·15 citations·filing 2006–2012
74Inventor score
Top patents by PatentIndex Score
7 records- 0179US8354741B2Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semiconductor packageSAMSUNG TECHWIN CO LTD·Filed 2012·Granted Jan 15, 2013·5 cites·11 claims
- 0271US8409726B2Printed circuit board with multiple metallic layers and method of manufacturing the sameSHIM CHANG-HAN·Filed 2009·Granted Apr 2, 2013·5 cites·9 claims
- 0365US8319340B2Lead frame and method of manufacturing the sameSHIM CHANG-HAN·Filed 2010·Granted Nov 27, 2012·3 cites·26 claims
- 0458US8278564B2Circuit board viaholes and method of manufacturing the sameSHIM CHANG-HAN·Filed 2009·Granted Oct 2, 2012·2 cites·6 claims
- 0551US2012279775A1Circuit board viaholes and method of manufacturing the sameSHIM CHANG-HAN·Filed 2012·Application pending·0 cites
- 0644US8110505B2Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semiconductor packageKANG SUNG-IL·Filed 2009·Granted Feb 7, 2012·0 cites·9 claims
- 0738US2006291138A1Built-in type upper/lower electrode multi-layer part and method of manufacturing thereofSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
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