Inventor · disambiguated record
Douglas L. Thompson
Also filed as: THOMPSON DOUGLAS L
8 granted patents·7 pending applications·43 citations·filing 2005–2012
85Inventor score
Files withINNOVATIVE MICRO TECHNOLOGY8FOSTER JOHN S3BISHOP JAMIE H1GUDEMAN CHRIS1INNOVATIVE MICRO TECHONOLOGY1
Top patents by PatentIndex Score
15 records- 0183US8993311B2Multi-stage cartridge for MEMS particle storing systemFOSTER JOHN S·Filed 2012·Granted Mar 31, 2015·10 cites·18 claims
- 0279US7687304B2Current-driven device using NiMn alloy and method of manufactureINNOVATIVE MICRO TECHNOLOGY·Filed 2006·Granted Mar 30, 2010·3 cites·20 claims
- 0376US8736081B2Wafer level hermetic bond using metal alloy with keeper layerFOSTER JOHN S·Filed 2012·Granted May 27, 2014·4 cites·19 claims
- 0474US8088651B1System and method for providing access to an encapsulated deviceTHOMPSON DOUGLAS L·Filed 2008·Granted Jan 3, 2012·6 cites·20 claims
- 0573US7688167B2Contact electrode for microdevices and etch method of manufactureINNOVATIVE MICRO TECHNOLOGY·Filed 2006·Granted Mar 30, 2010·7 cites·20 claims
- 0673US7550778B2System and method for providing access to an encapsulated deviceINNOVATIVE MICRO TECHNOLOGY·Filed 2006·Granted Jun 23, 2009·4 cites·16 claims
- 0771US7812703B2MEMS device using NiMn alloy and method of manufactureINNOVATIVE MICRO TECHNOLOGY·Filed 2006·Granted Oct 12, 2010·6 cites·20 claims
- 0869US8288211B2Wafer level hermetic bond using metal alloy with keeper layerFOSTER JOHN S·Filed 2010·Granted Oct 16, 2012·3 cites·21 claims
- 0952US2008318349A1Wafer level hermetic bond using metal alloyINNOVATIVE MICRO TECHNOLOGY·Filed 2008·Application pending·0 cites
- 1044US2012164718A1Removable/disposable apparatus for MEMS particle sorting deviceBISHOP JAMIE H·Filed 2008·Application pending·0 cites
- 1143US2007048887A1Wafer level hermetic bond using metal alloyINNOVATIVE MICRO TECHNOLOGY·Filed 2005·Application pending·0 cites
- 1242US2008250785A1Micromechanical device with gold alloy contacts and method of manufactureINNOVATIVE MICRO TECHNOLOGY·Filed 2007·Application pending·0 cites
- 1342US2008169521A1MEMS structure using carbon dioxide and method of fabricationINNOVATIVE MICRO TECHONOLOGY·Filed 2007·Application pending·0 cites
- 1437US2007207584A1Method and apparatus for curing epoxy-based photoresist using a continuously varying temperature profileINNOVATIVE MICRO TECHNOLOGY·Filed 2006·Application pending·0 cites
- 1537US2013199730A1Wafer bonding chamber with dissimilar wafer temperaturesGUDEMAN CHRIS·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →