Inventor · disambiguated record
Paul R. Moehle
Also filed as: MOEHLE PAUL R
14 granted patents·1 pending application·354 citations·filing 1990–2007
92Inventor score
Files withTEXAS INSTRUMENTS INC14
Top patents by PatentIndex Score
15 records- 0196US6194777B1Leadframes with selective palladium platingTEXAS INSTRUMENTS INC·Filed 1998·Granted Feb 27, 2001·244 cites·2 claims
- 0282US6953986B2Leadframes for high adhesion semiconductor devices and method of fabricationTEXAS INSTRUMENTS INC·Filed 2000·Granted Oct 11, 2005·26 cites·1 claims
- 0375US7245006B2Palladium-spot leadframes for high adhesion semiconductor devices and method of fabricationTEXAS INSTRUMENTS INC·Filed 2005·Granted Jul 17, 2007·5 cites·16 claims
- 0473US7148085B2Gold spot plated leadframes for semiconductor devices and method of fabricationTEXAS INSTRUMENTS INC·Filed 2003·Granted Dec 12, 2006·17 cites·6 claims
- 0566US6187166B1Integrated solution electroplating system and processTEXAS INSTRUMENTS INC·Filed 1999·Granted Feb 13, 2001·17 cites·13 claims
- 0664US6838757B2Preplating of semiconductor small outline no-lead leadframesTEXAS INSTRUMENTS INC·Filed 2001·Granted Jan 4, 2005·12 cites·8 claims
- 0763US6443167B1Gradient dragout system in a continuous plating lineTEXAS INSTRUMENTS INC·Filed 2000·Granted Sep 3, 2002·4 cites·5 claims
- 0859US7939378B2Palladium-spot leadframes for high adhesion semiconductor devices and method of fabricationTEXAS INSTRUMENTS INC·Filed 2007·Granted May 10, 2011·1 cites·16 claims
- 0945US6956282B1Stabilizer/spacer for semiconductor deviceTEXAS INSTRUMENTS INC·Filed 1997·Granted Oct 18, 2005·16 cites·14 claims
- 1045US6780253B2Gradient dragout system in a continuous plating lineTEXAS INSTRUMENTS INC·Filed 2002·Granted Aug 24, 2004·0 cites·10 claims
- 1138US5104510APlating systemTEXAS INSTRUMENTS INC·Filed 1990·Granted Apr 14, 1992·4 cites·12 claims
- 1238US2003011048A1Semiconductor circuit assembly having a plated leadframe including gold selectively covering areas to be solderedFiled 2000·Application pending·0 cites
- 1332US6187153B1Comparator for monitoring the deposition of an electrically conductive material on a leadframe to warn of improper operation of a leadframe electroplating processTEXAS INSTRUMENTS INC·Filed 1999·Granted Feb 13, 2001·2 cites·9 claims
- 1431US6019886AComparator for monitoring the deposition of an electrically conductive material on a leadframe to warn of improper operation of a leadframe electroplating processTEXAS INSTRUMENTS INC·Filed 1997·Granted Feb 1, 2000·3 cites·8 claims
- 1527US6238845B1Method of forming lead frames with preformation supportTEXAS INSTRUMENTS INC·Filed 1998·Granted May 29, 2001·3 cites·8 claims
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