Inventor · disambiguated record
Katsumi Satou
Also filed as: SATOU KATSUMI
3 granted patents·11 citations·filing 2002–2004
61Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP3
Top patents by PatentIndex Score
3 records- 0160US6831351B2Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base materialMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Dec 14, 2004·10 cites·4 claims
- 0240US7057298B2Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base materialMITSUBISHI ELECTRIC CORP·Filed 2004·Granted Jun 6, 2006·1 cites·3 claims
- 0337US6861730B2Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base materialMITSUBISHI ELECTRIC CORP·Filed 2004·Granted Mar 1, 2005·0 cites·3 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →