Inventor · disambiguated record
Masayuki Motonari
Also filed as: MOTONARI MASAYUKI
21 granted patents·6 pending applications·559 citations·filing 1995–2015
95Inventor score
Top patents by PatentIndex Score
27 records- 0197US6375545B1Chemical mechanical method of polishing wafer surfacesTOSHIBA KK·Filed 2000·Granted Apr 23, 2002·131 cites·17 claims
- 0295US6454819B1Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor deviceTOSHIBA KK·Filed 2000·Granted Sep 24, 2002·108 cites·37 claims
- 0394US6579153B2Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing processJSR CORP·Filed 2001·Granted Jun 17, 2003·101 cites·33 claims
- 0490US6447695B1Aqueous dispersion composition for chemical mechanical polishing for use in manufacture of semiconductor devicesJSR CORP·Filed 2000·Granted Sep 10, 2002·52 cites·21 claims
- 0589US6832949B2Window member for chemical mechanical polishing and polishing padJSR CORP·Filed 2002·Granted Dec 21, 2004·44 cites·24 claims
- 0684US8927201B2Multilayer resist process pattern-forming method and multilayer resist process inorganic film-forming compositionJSR CORP·Filed 2013·Granted Jan 6, 2015·4 cites·18 claims
- 0783US7183211B2Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishingJSR CORP·Filed 2003·Granted Feb 27, 2007·29 cites·51 claims
- 0871US6653267B2Aqueous dispersion for chemical mechanical polishing used for polishing of copperTOSHIBA KK·Filed 2001·Granted Nov 25, 2003·13 cites·14 claims
- 0971US6565767B2Polymer particles and polishing material containing themJSR CORP·Filed 2001·Granted May 20, 2003·13 cites·15 claims
- 1070US8574330B2Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method for semiconductor deviceNAMIE YUUJI·Filed 2007·Granted Nov 5, 2013·5 cites·14 claims
- 1167US8128464B2Chemical mechanical polishing padMOTONARI MASAYUKI·Filed 2009·Granted Mar 6, 2012·5 cites·19 claims
- 1263US8262435B2Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and chemical mechanical polishing aqueous dispersion preparation kitKUNITANI EIICHIROU·Filed 2009·Granted Sep 11, 2012·2 cites·7 claims
- 1362US10090163B2Inorganic film-forming composition for multilayer resist processes, and pattern-forming methodJSR CORP·Filed 2015·Granted Oct 2, 2018·1 cites·18 claims
- 1462US9182671B2Method for forming pattern, and composition for forming resist underlayer filmJSR CORP·Filed 2012·Granted Nov 10, 2015·1 cites·14 claims
- 1561US5691413AEthylene-α-olefin-non-conjugated diene copolymer rubber compositionJAPAN SYNTHETIC RUBBER CO LTD·Filed 1995·Granted Nov 25, 1997·21 cites·15 claims
- 1660US9091922B2Resin composition, resist underlayer film, resist underlayer film-forming method and pattern-forming methodJSR CORP·Filed 2012·Granted Jul 28, 2015·1 cites·24 claims
- 1758US7087530B2Aqueous dispersion for chemical mechanical polishingTOSHIBA KK·Filed 2003·Granted Aug 8, 2006·5 cites·14 claims
- 1857US8741008B2Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing methodMOTONARI MASAYUKI·Filed 2008·Granted Jun 3, 2014·1 cites·10 claims
- 1956US6068769AAqueous dispersion slurry of inorganic particles and production methods thereofJSR CORP·Filed 1998·Granted May 30, 2000·20 cites·2 claims
- 2052US2015198882A9Composition for forming resist underlayer film, resist underlayer film and resist underlayer film-forming method, and pattern-forming methodJSR CORP·Filed 2014·Application pending·0 cites
- 2148US7153369B2Method of chemical mechanical polishingJSR CORP·Filed 2002·Granted Dec 26, 2006·2 cites·29 claims
- 2248US2014011360A1Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method for semiconductor deviceJSR CORP·Filed 2013·Application pending·0 cites
- 2347US9268229B2Composition for forming resist underlayer film, and pattern-forming methodJSR CORP·Filed 2013·Granted Feb 23, 2016·0 cites·15 claims
- 2446US2009189510A1Metal-coating material, method for protecting metal, and light emitting deviceJSR CORP·Filed 2009·Application pending·0 cites
- 2539US2001049912A1Aqueous dispersion for chemical mechanical polishingJSR CORP·Filed 2001·Application pending·0 cites
- 2638US2004162011A1Aqueous dispersion for chemical mechanical polishing and production process of semiconductor deviceJSR CORP·Filed 2003·Application pending·0 cites
- 2736US2002005017A1Aqueous dispersion for chemical mechanical polishingJSR CORP·Filed 2001·Application pending·0 cites
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