Inventor · disambiguated record
Raschid J. Bezama
Also filed as: BEZAMA RASCHID J · BEZAMA RASCHID JOSE
74 granted patents·7 pending applications·1,445 citations·filing 1986–2016
99Inventor score
Top patents by PatentIndex Score
81 records- 0198US7516776B2Microjet module assemblyIBM·Filed 2005·Granted Apr 14, 2009·68 cites·2 claims
- 0297US7992627B2Microjet module assemblyIBM·Filed 2008·Granted Aug 9, 2011·55 cites·21 claims
- 0397US6459039B1Method and apparatus to manufacture an electronic package with direct wiring patternIBM·Filed 2000·Granted Oct 1, 2002·125 cites·31 claims
- 0496US8177945B2Multi-anode system for uniform plating of alloysARVIN CHARLES L·Filed 2007·Granted May 15, 2012·17 cites·20 claims
- 0596US6330157B1Variable thermal exchanger and method thereofIBM·Filed 1999·Granted Dec 11, 2001·83 cites·8 claims
- 0696US5870823AMethod of forming a multilayer electronic packaging substrate with integral cooling channelsIBM·Filed 1996·Granted Feb 16, 1999·229 cites·18 claims
- 0795US7190580B2Apparatus and methods for microchannel cooling of semiconductor integrated circuit packagesIBM·Filed 2004·Granted Mar 13, 2007·103 cites·29 claims
- 0893US8803317B2Structures for improving current carrying capability of interconnects and methods of fabricating the sameARVIN CHARLES L·Filed 2012·Granted Aug 12, 2014·5 cites·15 claims
- 0993US8115303B2Semiconductor package structures having liquid coolers integrated with first level chip package modulesBEZAMA RASCHID JOSE·Filed 2008·Granted Feb 14, 2012·28 cites·11 claims
- 1093US7255153B2High performance integrated MLC cooling device for high power density ICS and method for manufacturingIBM·Filed 2005·Granted Aug 14, 2007·25 cites·17 claims
- 1193US7139172B2Apparatus and methods for microchannel cooling of semiconductor integrated circuit packagesIBM·Filed 2004·Granted Nov 21, 2006·83 cites·18 claims
- 1291US8772927B2Semiconductor package structures having liquid cooler integrated with first level chip package modulesBEZAMA RASCHID JOSE·Filed 2011·Granted Jul 8, 2014·12 cites·10 claims
- 1391US7802442B2High power microjet coolerIBM·Filed 2008·Granted Sep 28, 2010·18 cites·20 claims
- 1491US6332782B1Spatial transformation interposer for electronic packagingIBM·Filed 2000·Granted Dec 25, 2001·53 cites·45 claims
- 1589US8637392B2Solder interconnect with non-wettable sidewall pillars and methods of manufactureARVIN CHARLES L·Filed 2010·Granted Jan 28, 2014·9 cites·23 claims
- 1683US7536870B2High power microjet coolerIBM·Filed 2006·Granted May 26, 2009·10 cites·3 claims
- 1782US8107800B2Method and structure to control thermal gradients in semiconductor wafers during rapid thermal processingBEZAMA RASCHID J·Filed 2008·Granted Jan 31, 2012·9 cites·6 claims
- 1882US7446859B2Apparatus and method for reducing contamination in immersion lithographyIBM·Filed 2006·Granted Nov 4, 2008·6 cites·10 claims
- 1982US5541005ALarge ceramic article and method of manufacturingIBM·Filed 1995·Granted Jul 30, 1996·64 cites·19 claims
- 2081US8505617B2Structure and apparatus for cooling integrated circuits using copper microchannelsBEZAMA RASCHID JOSE·Filed 2012·Granted Aug 13, 2013·3 cites·6 claims
- 2180US6003418APunched slug removal systemIBM·Filed 1997·Granted Dec 21, 1999·35 cites·14 claims
- 2279US10177075B2Liquid cooled compliant heat sink and related methodIBM·Filed 2016·Granted Jan 8, 2019·2 cites·6 claims
- 2379US9035459B2Structures for improving current carrying capability of interconnects and methods of fabricating the sameARVIN CHARLES L·Filed 2009·Granted May 19, 2015·1 cites·10 claims
- 2478US9574283B2Rinsing and drying for electrochemical processingIBM·Filed 2015·Granted Feb 21, 2017·1 cites·15 claims
- 2578US8784618B2Working electrode design for electrochemical processing of electronic componentsARVIN CHARLES L·Filed 2010·Granted Jul 22, 2014·1 cites·9 claims
- 2678US8210243B2Structure and apparatus for cooling integrated circuits using cooper microchannelsBEZAMA RASCHID JOSE·Filed 2008·Granted Jul 3, 2012·4 cites·13 claims
- 2775US7111797B2Non-contact fluid particle cleaner and methodIBM·Filed 2004·Granted Sep 26, 2006·21 cites·20 claims
- 2874US5585663ASelf cooling electrically programmable fuseIBM·Filed 1995·Granted Dec 17, 1996·40 cites·10 claims
- 2973US5622892AMethod of making a self cooling electrically programmable fuseIBM·Filed 1995·Granted Apr 22, 1997·37 cites·11 claims
- 3071US9018760B2Solder interconnect with non-wettable sidewall pillars and methods of manufactureIBM·Filed 2013·Granted Apr 28, 2015·2 cites·13 claims
- 3171US8418751B2Stacked and redundant chip coolersBEZAMA RASCHID JOSE·Filed 2008·Granted Apr 16, 2013·5 cites·7 claims
- 3271US7869002B2Reducing contamination in immersion lithographyIBM·Filed 2008·Granted Jan 11, 2011·3 cites·7 claims
- 3370US6509687B1Metal/dielectric laminate with electrodes and process thereofIBM·Filed 1999·Granted Jan 21, 2003·21 cites·43 claims
- 3469US6627020B2Method for sinter distortion controlIBM·Filed 2001·Granted Sep 30, 2003·15 cites·20 claims
- 3568US8623194B2Multi-anode system for uniform plating of alloysARVIN CHARLES L·Filed 2012·Granted Jan 7, 2014·0 cites·18 claims
- 3668US7332805B2Electronic package with improved current carrying capability and method of forming the sameIBM·Filed 2004·Granted Feb 19, 2008·12 cites·20 claims
- 3768US5444287AThermally activated noise immune fuseIBM·Filed 1994·Granted Aug 22, 1995·32 cites·19 claims
- 3867US7782445B2Reducing contamination in immersion lithographyIBM·Filed 2008·Granted Aug 24, 2010·2 cites·3 claims
- 3967US7684194B2Systems and methods for cooling an electronic deviceIBM·Filed 2008·Granted Mar 23, 2010·3 cites·23 claims
- 4066US8551303B2Multi-anode system for uniform plating of alloysARVIN CHARLES L·Filed 2012·Granted Oct 8, 2013·0 cites·20 claims
- 4166US5538582AMethod for forming cavities without using an insertIBM·Filed 1994·Granted Jul 23, 1996·25 cites·26 claims
- 4264US8926820B2Working electrode design for electrochemical processing of electronic componentsARVIN CHARLES L·Filed 2012·Granted Jan 6, 2015·0 cites·6 claims
- 4364US8674506B2Structures and methods to reduce maximum current density in a solder ballIBM·Filed 2013·Granted Mar 18, 2014·1 cites·13 claims
- 4464US7407883B2Electronic package with improved current carrying capability and method of forming the sameIBM·Filed 2006·Granted Aug 5, 2008·2 cites·20 claims
- 4564US6117367APastes for improved substrate dimensional controlIBM·Filed 1998·Granted Sep 12, 2000·22 cites·10 claims
- 4663US8446006B2Structures and methods to reduce maximum current density in a solder ballBEZAMA RASCHID J·Filed 2009·Granted May 21, 2013·2 cites·22 claims
- 4761US8450619B2Current spreading in organic substratesARVIN CHARLES L·Filed 2010·Granted May 28, 2013·1 cites·20 claims
- 4861US5907985APunch apparatus with improved slug removal efficiencyIBM·Filed 1997·Granted Jun 1, 1999·20 cites·18 claims
- 4959US6285080B1Planar metallized substrate with embedded camber control material and method thereofIBM·Filed 1998·Granted Sep 4, 2001·21 cites·22 claims
- 5058US6955777B2Method of forming a plate for dispensing chemicalsIBM·Filed 2003·Granted Oct 18, 2005·2 cites·13 claims
Showing the top 50 of 81 patent records by PatentIndex Score.
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