Inventor · disambiguated record
Philip J. Ireland
Also filed as: IRELAND PHILIP J · IRELAND PHILIP MICHAEL WILLIAM
69 granted patents·3 pending applications·1,883 citations·filing 1994–2019
99Inventor score
Top patents by PatentIndex Score
72 records- 0199US5751012APolysilicon pillar diode for use in a non-volatile memory cellMICRON TECHNOLOGY INC·Filed 1995·Granted May 12, 1998·911 cites·24 claims
- 0297US6358862B1Passivation integrity improvementsMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 19, 2002·207 cites·21 claims
- 0395US9557376B2Apparatuses and methods for die seal crack detectionMICRON TECHNOLOGY INC·Filed 2016·Granted Jan 31, 2017·10 cites·5 claims
- 0494US9287184B2Apparatuses and methods for die seal crack detectionMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 15, 2016·14 cites·9 claims
- 0593US5990021AIntegrated circuit having self-aligned CVD-tungsten/titanium contact plugs strapped with metal interconnect and method of manufactureMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 23, 1999·156 cites·11 claims
- 0690US8853072B2Methods of forming through-substrate interconnectsWOOD ALAN G·Filed 2011·Granted Oct 7, 2014·9 cites·26 claims
- 0789US5466639ADouble mask process for forming trenches and contacts during the formation of a semiconductor memory deviceMICRON SEMICONDUCTOR INC·Filed 1994·Granted Nov 14, 1995·80 cites·20 claims
- 0888US6627529B2Capacitance reduction by tunnel formation for use with semiconductor deviceMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 30, 2003·38 cites·29 claims
- 0988US6388284B2Capacitor structuresMICRON TECHNOLOGY INC·Filed 2001·Granted May 14, 2002·44 cites·29 claims
- 1085US10504859B2Electronic component guard ringINTEL CORP·Filed 2016·Granted Dec 10, 2019·3 cites·13 claims
- 1183US7989957B2Self-aligned, integrated circuit contactMICRON TECHNOLOGY INC·Filed 2009·Granted Aug 2, 2011·7 cites·16 claims
- 1283US6348411B1Method of making a contact structureMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 19, 2002·50 cites·43 claims
- 1381US6909128B2Capacitance reduction by tunnel formation for use with a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 21, 2005·23 cites·7 claims
- 1475US7968403B2Method of fabricating a sleeve insulator for a contact structureMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 28, 2011·4 cites·10 claims
- 1575US6291289B2Method of forming DRAM trench capacitor with metal layer over hemispherical grain polysiliconMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 18, 2001·41 cites·13 claims
- 1674US9583419B2Semiconductor constructions having through-substrate interconnectsMICRON TECHNOLOGY INC·Filed 2014·Granted Feb 28, 2017·2 cites·12 claims
- 1774US7943503B2Trench interconnect structure and formation methodMICRON TECHNOLOGY INC·Filed 2006·Granted May 17, 2011·3 cites·48 claims
- 1874US6777813B2Fill pattern generation for spin-on-glass and related self-planarization depositionMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 17, 2004·14 cites·5 claims
- 1973US6563219B2Passivation integrity improvementsMICRON TECHNOLOGY INC·Filed 2001·Granted May 13, 2003·14 cites·5 claims
- 2073US6420257B2Process for forming trenches and contacts during the formation of a semiconductor memory deviceMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 16, 2002·15 cites·16 claims
- 2172US6696359B1Design layout method for metal lines of an integrated circuitMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 24, 2004·15 cites·18 claims
- 2270US6479378B1Process for forming electrical interconnects in integrated circuitsMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 12, 2002·11 cites·26 claims
- 2369US6780762B2Self-aligned, integrated circuit contact and formation methodMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 24, 2004·11 cites·41 claims
- 2469US6531352B1Methods of forming conductive interconnectsMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 11, 2003·11 cites·23 claims
- 2568US6686288B1Integrated circuit having self-aligned CVD-tungsten/titanium contact plugs strapped with metal interconnect and method of manufactureMICRON TECHNOLOGY INC·Filed 1999·Granted Feb 3, 2004·30 cites·10 claims
- 2667US9343362B2Microelectronic devices with through-silicon vias and associated methods of manufacturingMICRON TECHNOLOGY INC·Filed 2013·Granted May 17, 2016·1 cites·15 claims
- 2767US6667531B1Method and apparatus for a deposited fill layerMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 23, 2003·12 cites·35 claims
- 2866US6303492B1Expanded implantation of contact holesMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 16, 2001·19 cites·42 claims
- 2965US6812512B2Integrated circuit having self-aligned CVD-tungsten/titanium contact plugs strapped with metal interconnect and method of manufactureMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 2, 2004·11 cites·52 claims
- 3064US11018097B2Electronic component guard ringINTEL CORP·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 3163US8283785B2Interconnect regionsKIRBY KYLE K·Filed 2010·Granted Oct 9, 2012·1 cites·22 claims
- 3262US6800517B2Methods of forming conductive interconnectsMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 5, 2004·7 cites·15 claims
- 3361US8482131B2Via structureIRELAND PHILIP J·Filed 2011·Granted Jul 9, 2013·1 cites·19 claims
- 3461US7352019B2Capacitance reduction by tunnel formation for use with a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 1, 2008·1 cites·10 claims
- 3561US6740916B1Contact structure for integrated circuit devicesMICRON TECHNOLOGY INC·Filed 1999·Granted May 25, 2004·17 cites·23 claims
- 3658US7115506B2Method of making a contact structureMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 3, 2006·5 cites·43 claims
- 3756US10121738B2Semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 6, 2018·0 cites·15 claims
- 3856US9347985B2Via chain testing structure and methodIRELAND PHILIP J·Filed 2011·Granted May 24, 2016·1 cites·11 claims
- 3956US6806575B2Subresolution features for a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 19, 2004·4 cites·20 claims
- 4055US7387866B2Photolithography process using multiple anti-reflective coatingsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 17, 2008·3 cites·3 claims
- 4155US7138719B2Trench interconnect structure and formation methodMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 21, 2006·3 cites·29 claims
- 4255US6867498B2Metal line layout of an integrated circuitMICRON TECHNOLOGY INC·Filed 2004·Granted Mar 15, 2005·5 cites·46 claims
- 4355US6525426B2Subresolution features for a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 25, 2003·4 cites·41 claims
- 4454US10978386B2Microelectronic devices with through-silicon vias and associated methods of manufacturingMICRON TECHNOLOGY INC·Filed 2016·Granted Apr 13, 2021·0 cites·15 claims
- 4554US6110789AContact formation using two anneal stepsMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 29, 2000·15 cites·36 claims
- 4653US7646099B2Self-aligned, integrated circuit contactMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 12, 2010·3 cites·16 claims
- 4753US7026717B2Fill pattern generation for spin-on glass and related self-planarization depositionMICRON TECHNOLOGY INC·Filed 2004·Granted Apr 11, 2006·3 cites·5 claims
- 4853US6846736B2Creation of subresolution features via flow characteristicsMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 25, 2005·3 cites·26 claims
- 4952US8680595B2Sleeve insulators and semiconductor device including the sameIRELAND PHILIP J·Filed 2011·Granted Mar 25, 2014·0 cites·20 claims
- 5052US8410612B2Interconnect regionsKIRBY KYLE K·Filed 2012·Granted Apr 2, 2013·0 cites·21 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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