Inventor · disambiguated record
Jaekyung Yoo
Also filed as: YOO JAEKYUNG
10 granted patents·8 pending applications·7 citations·filing 2020–2025
81Inventor score
Files withSAMSUNG ELECTRONICS CO LTD18
Top patents by PatentIndex Score
18 records- 0194US11923343B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 5, 2024·2 cites·20 claims
- 0292US12062639B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 13, 2024·2 cites·20 claims
- 0390US11462462B2Semiconductor packages including a recessed conductive postSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 4, 2022·3 cites·19 claims
- 0484US2025300140A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0584US2025062248A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0682US12362328B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·19 claims
- 0779US12165991B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 0879US2025364282A1Molding apparatus of semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0976US2025167137A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1072US11594499B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 1171US2024203945A1Semiconductor package including mold layer and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1270US12394641B2Molding apparatus of semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 1370US11538792B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 27, 2022·0 cites·20 claims
- 1462US11923340B2Semiconductor package including mold layer and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 1558US2025149494A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1656US2024088092A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1753US2024079299A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1847US11791282B2Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 17, 2023·0 cites·16 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →