Inventor · disambiguated record
Hideki Mukuno
Also filed as: MUKUNO HIDEKI
6 granted patents·1 pending application·126 citations·filing 2000–2014
84Inventor score
Top patents by PatentIndex Score
7 records- 0186US6555052B2Electron device and semiconductor deviceHITACHI LTD·Filed 2001·Granted Apr 29, 2003·42 cites·18 claims
- 0285US6541364B2Bump forming method and bump forming apparatusHITACHI LTD·Filed 2001·Granted Apr 1, 2003·43 cites·9 claims
- 0377US6774490B2Electronic deviceHITACHI LTD·Filed 2003·Granted Aug 10, 2004·22 cites·10 claims
- 0468US6761301B2Soldering machineHITACHI LTD·Filed 2002·Granted Jul 13, 2004·13 cites·4 claims
- 0555US6412681B2Soldering machineHITACHI LTD·Filed 2000·Granted Jul 2, 2002·6 cites·3 claims
- 0642US9779976B2Adhesive sheet, method for manufacturing semiconductor device using same, method for manufacturing thermal airflow sensor using same, and thermal airflow sensorHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2014·Granted Oct 3, 2017·0 cites·7 claims
- 0742US2007051777A1Soldering methodHITACHI LTD·Filed 2006·Application pending·0 cites
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