Inventor · disambiguated record
Subhash Gupta
Also filed as: GUPTA SUBHASH · GUPTA SUBHASH R
100 granted patents·9 pending applications·4,721 citations·filing 1978–2005
99Inventor score
Files withCHARTERED SEMICONDUCTOR MFG57ADVANCED MICRO DEVICES INC35GUPTA SUBHASH5TEXAS INSTRUMENTS INC3ANDERSEN CONSULTING2
Top patents by PatentIndex Score
109 records- 0199US6284657B1Non-metallic barrier formation for copper damascene type interconnectsCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Sep 4, 2001·190 cites·20 claims
- 0298US6348407B1Method to improve adhesion of organic dielectrics in dual damascene interconnectsCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Feb 19, 2002·250 cites·34 claims
- 0396US6352917B1Reversed damascene process for multiple level metal interconnectsCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Mar 5, 2002·140 cites·34 claims
- 0496US5926690ARun-to-run control process for controlling critical dimensionsADVANCED MICRO DEVICES INC·Filed 1997·Granted Jul 20, 1999·346 cites·20 claims
- 0595US5614765ASelf aligned via dual damasceneADVANCED MICRO DEVICES INC·Filed 1995·Granted Mar 25, 1997·172 cites·10 claims
- 0694US6683002B1Method to create a copper diffusion deterrent interfaceCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jan 27, 2004·71 cites·7 claims
- 0794US5705430ADual damascene with a sacrificial via fillADVANCED MICRO DEVICES INC·Filed 1995·Granted Jan 6, 1998·173 cites·16 claims
- 0892US6372636B1Composite silicon-metal nitride barrier to prevent formation of metal fluorides in copper damasceneCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 16, 2002·70 cites·36 claims
- 0991US5795823ASelf aligned via dual damasceneADVANCED MICRO DEVICES INC·Filed 1996·Granted Aug 18, 1998·114 cites·20 claims
- 1090US6380087B1CMP process utilizing dummy plugs in damascene processCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 30, 2002·89 cites·29 claims
- 1190US6350675B1Integration of silicon-rich material in the self-aligned via approach of dual damascene interconnectsCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Feb 26, 2002·55 cites·44 claims
- 1290US6184138B1Method to create a controllable and reproducible dual copper damascene structureCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted Feb 6, 2001·121 cites·13 claims
- 1390US6114243AMethod to avoid copper contamination on the sidewall of a via or a dual damascene structureCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted Sep 5, 2000·123 cites·28 claims
- 1489US6380084B1Method to form high performance copper damascene interconnects by de-coupling via and metal line fillingCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 30, 2002·59 cites·33 claims
- 1589US6274499B1Method to avoid copper contamination during copper etching and CMPCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted Aug 14, 2001·98 cites·30 claims
- 1689USD253789STongue cleanerGUPTA SUBHASH R·Filed 1978·Granted Dec 25, 1979·25 cites·1 claims
- 1788US6489233B2Non-metallic barrier formations for copper damascene type interconnectsCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Dec 3, 2002·36 cites·16 claims
- 1888US4888692AReal-time scheduling systemTEXAS INSTRUMENTS INC·Filed 1988·Granted Dec 19, 1989·88 cites·7 claims
- 1987US6566260B2Non-metallic barrier formations for copper damascene type interconnectsCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted May 20, 2003·32 cites·19 claims
- 2087US6225221B1Method to deposit a copper seed layer for dual damascene interconnectsCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted May 1, 2001·53 cites·20 claims
- 2186US6417088B1Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bondingCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jul 9, 2002·44 cites·22 claims
- 2286US6391732B1Method to form self-aligned, L-shaped sidewall spacersCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted May 21, 2002·45 cites·16 claims
- 2386US6378759B1Method of application of conductive cap-layer in flip-chip, COB, and micro metal bondingCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 30, 2002·37 cites·17 claims
- 2486US6346468B1Method for forming an L-shaped spacer using a disposable polysilicon spacerCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Feb 12, 2002·39 cites·6 claims
- 2585US6040619ASemiconductor device including antireflective etch stop layerADVANCED MICRO DEVICES INC·Filed 1997·Granted Mar 21, 2000·67 cites·10 claims
- 2684US6720204B2Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bondingCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Apr 13, 2004·38 cites·18 claims
- 2784US6465888B2Composite silicon-metal nitride barrier to prevent formation of metal fluorides in copper damasceneCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Oct 15, 2002·33 cites·7 claims
- 2884US5691238ASubtractive dual damasceneADVANCED MICRO DEVICES INC·Filed 1995·Granted Nov 25, 1997·68 cites·19 claims
- 2984US5686354ADual damascene with a protective mask for via etchingADVANCED MICRO DEVICES INC·Filed 1995·Granted Nov 11, 1997·80 cites·11 claims
- 3083US6429122B2Non metallic barrier formations for copper damascene type interconnectsCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Aug 6, 2002·25 cites·26 claims
- 3183USD267508STongue cleanerDENTECO INC·Filed 1980·Granted Jan 4, 1983·21 cites·1 claims
- 3282US6251786B1Method to create a copper dual damascene structure with less dishing and erosionCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted Jun 26, 2001·65 cites·20 claims
- 3381US5910453ADeep UV anti-reflection coating etchADVANCED MICRO DEVICES INC·Filed 1996·Granted Jun 8, 1999·77 cites·18 claims
- 3480US6475810B1Method of manufacturing embedded organic stop layer for dual damascene patterningCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Nov 5, 2002·24 cites·24 claims
- 3579US6531390B2Non-metallic barrier formations for copper damascene type interconnectsCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Mar 11, 2003·19 cites·25 claims
- 3678US6540841B1Method and apparatus for removing contaminants from the perimeter of a semiconductor substrateCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Apr 1, 2003·13 cites·12 claims
- 3778US6429117B1Method to create copper traps by modifying treatment on the dielectrics surfaceCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Aug 6, 2002·21 cites·34 claims
- 3877USRE39518ERun to run control process for controlling critical dimensionsADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 13, 2007·19 cites·104 claims
- 3977US6255266B1Alkyldione peroxides as cleaning solutions for wafer fabsCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jul 3, 2001·9 cites·7 claims
- 4077US5265006ADemand scheduled partial carrier load planning system for the transportation industryANDERSEN CONSULTING·Filed 1990·Granted Nov 23, 1993·296 cites·48 claims
- 4177US5037506AMethod of stripping layers of organic materialsGUPTA SUBHASH·Filed 1990·Granted Aug 6, 1991·65 cites·17 claims
- 4276US5770519ACopper reservoir for reducing electromigration effects associated with a conductive via in a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 1995·Granted Jun 23, 1998·49 cites·19 claims
- 4376USD354624STongue cleaner for integrally moulding with a tooth brushGUPTA SUBHASH·Filed 1993·Granted Jan 24, 1995·18 cites·1 claims
- 4475US6656643B2Method of extreme ultraviolet mask engineeringCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Dec 2, 2003·13 cites·24 claims
- 4575US6313018B1Process for fabricating semiconductor device including antireflective etch stop layerADVANCED MICRO DEVICES INC·Filed 2000·Granted Nov 6, 2001·20 cites·20 claims
- 4675US5255184AAirline seat inventory control method and apparatus for computerized airline reservation systemsANDERSEN CONSULTING·Filed 1990·Granted Oct 19, 1993·305 cites·22 claims
- 4774US6340608B1Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper padsCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Jan 22, 2002·21 cites·11 claims
- 4874US6225202B1Selective etching of unreacted nickel after salicidationCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted May 1, 2001·17 cites·29 claims
- 4974US5260868AMethod for calendaring future events in real-timeTEXAS INSTR INCORPORATE·Filed 1991·Granted Nov 9, 1993·151 cites·14 claims
- 5073US5841196AFluted via formation for superior metal step coverageADVANCED MICRO DEVICES INC·Filed 1997·Granted Nov 24, 1998·47 cites·5 claims
Showing the top 50 of 109 patent records by PatentIndex Score.
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