Inventor · disambiguated record
Toru Nomura
Also filed as: NOMURA TORU
19 granted patents·4 pending applications·858 citations·filing 1992–2014
96Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD16MATSUSHITA ELECTRONICS CORP3FIGARO ENG1NARISHIGE LIFEMED CO LTD1
Top patents by PatentIndex Score
23 records- 0197US6225146B1Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor deviceMATSUSHITA ELECTRONICS CORP·Filed 1999·Granted May 1, 2001·247 cites·20 claims
- 0294US6674154B2Lead frame with multiple rows of external terminalsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 6, 2004·104 cites·6 claims
- 0394US5977615ALead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor deviceMATSUSHITA ELECTRONICS CORP·Filed 1997·Granted Nov 2, 1999·159 cites·27 claims
- 0492US6710430B2Resin-encapsulated semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 23, 2004·85 cites·8 claims
- 0589US6498393B2Semiconductor device and method for the fabrication thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Dec 24, 2002·44 cites·11 claims
- 0684US6680220B2Method of embedding an identifying mark on the resin surface of an encapsulated semiconductor packageMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 20, 2004·32 cites·6 claims
- 0778US6692991B2Resin-encapsulated semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 17, 2004·19 cites·4 claims
- 0877US6909168B2Resin encapsulation semiconductor device utilizing grooved leads and die padMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jun 21, 2005·21 cites·10 claims
- 0975US7026192B2Terminal land frame and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Apr 11, 2006·19 cites·11 claims
- 1073US7125751B2Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portionsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Oct 24, 2006·4 cites·1 claims
- 1173US6680524B2Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 20, 2004·20 cites·5 claims
- 1271US5321249ASolid-state imaging device and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Jun 14, 1994·31 cites·4 claims
- 1367US7338838B2Resin-encapsulation semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Mar 4, 2008·3 cites·5 claims
- 1465US7309624B2Semiconductor device and method for the fabrication thereof including grinding a major portion of the frameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Dec 18, 2007·2 cites·2 claims
- 1560US5759367AGas sensorFIGARO ENG·Filed 1996·Granted Jun 2, 1998·26 cites·7 claims
- 1658US6667541B1Terminal land frame and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Dec 23, 2003·19 cites·16 claims
- 1752US5336367ASolid-state imaging device and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Aug 9, 1994·13 cites·4 claims
- 1844US9925660B2Method for positioning micro-tool and micro-manipulator deviceNARISHIGE LIFEMED CO LTD·Filed 2014·Granted Mar 27, 2018·0 cites·8 claims
- 1942US5708295ALead frame and method of manufacturing the same, and resin sealed semiconductor device and method of manufacturing the sameMATSUSHITA ELECTRONICS CORP·Filed 1996·Granted Jan 13, 1998·10 cites·16 claims
- 2042US2004155361A1Resin-encapsulated semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Application pending·0 cites
- 2142US2004155363A1Resin-encapsulated semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 2240US2003038359A1Semiconductor device and method for the fabrication thereofFiled 2002·Application pending·0 cites
- 2338US2002052056A1Semiconductor device and method for fabricating the sameFiled 2001·Application pending·0 cites
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