Inventor · disambiguated record
Rajinder S. Rai
Also filed as: RAI RAJINDER S · RAI RAJINDER SINGH
8 granted patents·2 pending applications·99 citations·filing 1998–2012
85Inventor score
Top patents by PatentIndex Score
10 records- 0176US6059952AMethod of fabricating coated powder materials and their use for high conductivity paste applicationsIBM·Filed 1998·Granted May 9, 2000·51 cites·41 claims
- 0268US6492600B1Laminate having plated microvia interconnects and method for forming the sameIBM·Filed 1999·Granted Dec 10, 2002·28 cites·16 claims
- 0354US6607613B2Solder ball with chemically and mechanically enhanced surface propertiesIBM·Filed 2001·Granted Aug 19, 2003·5 cites·12 claims
- 0453US6056831AProcess for chemically and mechanically enhancing solder surface propertiesIBM·Filed 1998·Granted May 2, 2000·13 cites·19 claims
- 0549US2008017410A1Method for forming a plated microvia interconnectJIMAREZ MIGUEL A·Filed 2007·Application pending·0 cites
- 0647US7328506B2Method for forming a plated microvia interconnectIBM·Filed 2002·Granted Feb 12, 2008·2 cites·14 claims
- 0742US2009241332A1Circuitized substrate and method of making sameLAUFFER JOHN M·Filed 2008·Application pending·0 cites
- 0841US8240031B2Method of joining a semiconductor device/chip to a printed wiring boardMARKOVICH VOYA R·Filed 2010·Granted Aug 14, 2012·0 cites·16 claims
- 0938US8592299B1Solder and electrically conductive adhesive based interconnection for CZT crystal attachMARKOVICH VOYA R·Filed 2012·Granted Nov 26, 2013·0 cites·8 claims
- 1029US6210547B1Enhanced solder surface and process for chemically and mechanically enhancing solder surface propertiesIBM·Filed 1999·Granted Apr 3, 2001·0 cites·18 claims
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