Inventor · disambiguated record
Atsushi Kuwano
Also filed as: KUWANO ATSUSHI
14 granted patents·1 pending application·307 citations·filing 1992–2014
93Inventor score
Top patents by PatentIndex Score
15 records- 0194US7629050B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2007·Granted Dec 8, 2009·11 cites·8 claims
- 0290US7553890B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2007·Granted Jun 30, 2009·11 cites·9 claims
- 0388US6777464B1Circuit connecting material, and structure and method of connecting circuit terminalHITACHI CHEMICAL CO LTD·Filed 1998·Granted Aug 17, 2004·86 cites·15 claims
- 0484US6133534AWiring board for electrical tests with bumps having polymeric coatingHITACHI CHEMICAL CO LTD·Filed 1994·Granted Oct 17, 2000·56 cites·2 claims
- 0583US6235842B1Phase-separated carboxyl group-containing elastomer modified phoenoxy resin optionally with epoxy resinHITACHI CHEMICAL CO LTD·Filed 1997·Granted May 22, 2001·71 cites·24 claims
- 0675US7968196B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2007·Granted Jun 28, 2011·1 cites·24 claims
- 0774US6568073B1Process for the fabrication of wiring board for electrical testsHITACHI CHEMICAL CO LTD·Filed 1998·Granted May 27, 2003·37 cites·5 claims
- 0867US7629056B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2004·Granted Dec 8, 2009·12 cites·9 claims
- 0965US7879956B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2007·Granted Feb 1, 2011·0 cites·18 claims
- 1059US5464673AInformation recording medium having recording layer with organic polymer and dye contained thereinHITACHI CHEMICAL CO LTD·Filed 1992·Granted Nov 7, 1995·10 cites·12 claims
- 1158US9745411B2Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and LED deviceHITACHI CHEMICAL CO LTD·Filed 2014·Granted Aug 29, 2017·1 cites·16 claims
- 1256US9349931B2Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and LED deviceNISHIYAMA TOMOO·Filed 2012·Granted May 24, 2016·2 cites·24 claims
- 1352US8142605B2Circuit-connecting material and circuit terminal connected structure and connecting methodWATANABE ITSUO·Filed 2011·Granted Mar 27, 2012·0 cites·27 claims
- 1452US5648135AInformation recording medium having recording layer with organic polymer and dye contained thereinHITACHI CHEMICAL CO LTD·Filed 1995·Granted Jul 15, 1997·9 cites·7 claims
- 1530US2014079913A1Multilayer resin sheet, resin sheet laminate, cured multilayer resin sheet and method for producing same, multilayer resin sheet with metal foil, and semiconductor deviceNISHIYAMA TOMOO·Filed 2012·Application pending·0 cites
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