Inventor · disambiguated record
James R. Wilcox
Also filed as: WILCOX JAMES · WILCOX JAMES R · WILCOX JAMES ROBERT
36 granted patents·1,129 citations·filing 1989–2013
98Inventor score
Top patents by PatentIndex Score
36 records- 0195US6373717B1Electronic package with high density interconnect layerIBM·Filed 2000·Granted Apr 16, 2002·97 cites·16 claims
- 0294US5038996ABonding of metallic surfacesIBM·Filed 1989·Granted Aug 13, 1991·80 cites·15 claims
- 0390US6351393B1Electronic package for electronic components and method of making sameIBM·Filed 1999·Granted Feb 26, 2002·71 cites·93 claims
- 0490US5874776AThermal stress relieving substrateIBM·Filed 1997·Granted Feb 23, 1999·107 cites·13 claims
- 0589US6104093AThermally enhanced and mechanically balanced flip chip package and method of formingIBM·Filed 1998·Granted Aug 15, 2000·92 cites·15 claims
- 0689US5949246ATest head for applying signals in a burn-in test of an integrated circuitIBM·Filed 1997·Granted Sep 7, 1999·65 cites·4 claims
- 0789US5847324AHigh performance electrical cableIBM·Filed 1996·Granted Dec 8, 1998·65 cites·8 claims
- 0888US6410988B1Thermally enhanced and mechanically balanced flip chip package and method of formingIBM·Filed 2000·Granted Jun 25, 2002·45 cites·18 claims
- 0987US5981312AMethod for injection molded flip chip encapsulationIBM·Filed 1997·Granted Nov 9, 1999·72 cites·12 claims
- 1085US6829823B2Method of making a multi-layered interconnect structureIBM·Filed 2002·Granted Dec 14, 2004·31 cites·25 claims
- 1184US6094060ATest head for applying signals in a burn-in test of an integrated circuitIBM·Filed 1999·Granted Jul 25, 2000·44 cites·7 claims
- 1281US7137826B2Temperature dependent semiconductor module connectorsIBM·Filed 2005·Granted Nov 21, 2006·8 cites·14 claims
- 1381US6094059AApparatus and method for burn-in/testing of integrated circuit devicesIBM·Filed 1999·Granted Jul 25, 2000·39 cites·2 claims
- 1481US5736679ADeformable interconnect structure for connecting an internal plane to a through-hole in a multilayer circuit boardIBM·Filed 1995·Granted Apr 7, 1998·49 cites·14 claims
- 1572US5659951AMethod for making printed circuit board with flush surface landsIBM·Filed 1996·Granted Aug 26, 1997·31 cites·17 claims
- 1668US6570261B2Method and apparatus for injection molded flip chip encapsulationIBM·Filed 2002·Granted May 27, 2003·11 cites·5 claims
- 1768US5442144AMultilayered circuit boardIBM·Filed 1994·Granted Aug 15, 1995·25 cites·7 claims
- 1866US5359767AMethod of making multilayered circuit boardIBM·Filed 1993·Granted Nov 1, 1994·24 cites·13 claims
- 1964US6369449B2Method and apparatus for injection molded flip chip encapsulationIBM·Filed 1999·Granted Apr 9, 2002·23 cites·5 claims
- 2063US7128579B1Hook interconnectIBM·Filed 2005·Granted Oct 31, 2006·7 cites·20 claims
- 2163US7024764B2Method of making an electronic packageIBM·Filed 2002·Granted Apr 11, 2006·8 cites·16 claims
- 2262US6427323B2Method for producing conductor interconnect with dendritesIBM·Filed 2001·Granted Aug 6, 2002·7 cites·9 claims
- 2361US7255571B2Temperature dependent semiconductor module connectorsIBM·Filed 2006·Granted Aug 14, 2007·1 cites·19 claims
- 2461US6562654B2Tented plated through-holes and method for fabrication thereofIBM·Filed 2001·Granted May 13, 2003·7 cites·13 claims
- 2559US5977642ADendrite interconnect for planarization and method for producing sameIBM·Filed 1997·Granted Nov 2, 1999·20 cites·21 claims
- 2656US6256874B1Conductor interconnect with dendrites through film and method for producing sameIBM·Filed 1999·Granted Jul 10, 2001·13 cites·15 claims
- 2756US5781413AMethod and apparatus for directing the input/output connection of integrated circuit chip cube configurationsIBM·Filed 1996·Granted Jul 14, 1998·22 cites·8 claims
- 2855US6249045B1Tented plated through-holes and method for fabrication thereofIBM·Filed 1999·Granted Jun 19, 2001·13 cites·13 claims
- 2953US7083901B2Joining member for Z-interconnect in electronic devices without conductive pasteIBM·Filed 2002·Granted Aug 1, 2006·4 cites·28 claims
- 3051US6739046B1Method for producing dendrite interconnect for planarizationIBM·Filed 2000·Granted May 25, 2004·3 cites·29 claims
- 3146US5403420AFabrication tool and method for parallel processor structure and packageIBM·Filed 1993·Granted Apr 4, 1995·15 cites·9 claims
- 3245US10609179B2Method and system establishing a network connectionTOSHIBA KK·Filed 2013·Granted Mar 31, 2020·0 cites·24 claims
- 3341US6228470B1Composite substrate for electronic componentsIBM·Filed 1998·Granted May 8, 2001·9 cites·20 claims
- 3438US6300575B1Conductor interconnect with dendrites through filmIBM·Filed 1997·Granted Oct 9, 2001·5 cites·13 claims
- 3536US5942127AFuel oil treatment unit and associated methodFiled 1997·Granted Aug 24, 1999·12 cites·1 claims
- 3635US5993579AHigh performance electrical cable and method of manufactureIBM·Filed 1997·Granted Nov 30, 1999·4 cites·6 claims
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