Inventor · disambiguated record
Hsing-Seng Wang
Also filed as: WANG HSING SENG
10 granted patents·1,055 citations·filing 1996–2002
93Inventor score
Files withIND TECH RES INST10
Top patents by PatentIndex Score
10 records- 0196US6590282B1Stacked semiconductor package formed on a substrate and method for fabricationIND TECH RES INST·Filed 2002·Granted Jul 8, 2003·145 cites·11 claims
- 0296US5977626AThermally and electrically enhanced PBGA packageIND TECH RES INST·Filed 1998·Granted Nov 2, 1999·426 cites·28 claims
- 0394US5736785ASemiconductor package for improving the capability of spreading heatIND TECH RES INST·Filed 1996·Granted Apr 7, 1998·192 cites·37 claims
- 0490US6207475B1Method for dispensing underfill and devices formedIND TECH RES INST·Filed 1999·Granted Mar 27, 2001·128 cites·12 claims
- 0583US6479321B2One-step semiconductor stack packaging methodIND TECH RES INST·Filed 2001·Granted Nov 12, 2002·38 cites·46 claims
- 0676US6255140B1Flip chip chip-scale packageIND TECH RES INST·Filed 1999·Granted Jul 3, 2001·50 cites·10 claims
- 0774US6536653B2One-step bumping/bonding method for forming semiconductor packagesIND TECH RES INST·Filed 2001·Granted Mar 25, 2003·21 cites·27 claims
- 0869US5783860AHeat sink bonded to a die paddle having at least one apertureIND TECH RES INST·Filed 1997·Granted Jul 21, 1998·34 cites·7 claims
- 0942US5789270AMethod for assembling a heat sink to a die paddleIND TECH RES INST·Filed 1996·Granted Aug 4, 1998·12 cites·19 claims
- 1041US5672547AMethod for bonding a heat sink to a die paddleIND TECH RES INST·Filed 1996·Granted Sep 30, 1997·9 cites·15 claims
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