Inventor · disambiguated record
Scott Meikle
Also filed as: MEIKLE SCOTT · MEIKLE SCOTT G
130 granted patents·12 pending applications·6,345 citations·filing 1992–2010
99Inventor score
Files withMICRON TECHNOLOGY INC121MICRON SEMICONDUCTOR INC4ROUND ROCK RES LLC2BLALOCK GUY1CHOPRA DINESH1
Top patents by PatentIndex Score
142 records- 0198US6250994B1Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing padsMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 26, 2001·243 cites·4 claims
- 0298US6206756B1Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive padMICRON TECHNOLOGY INC·Filed 1998·Granted Mar 27, 2001·273 cites·48 claims
- 0398US5871392AUnder-pad for chemical-mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1996·Granted Feb 16, 1999·204 cites·27 claims
- 0498US5439551AChemical-mechanical polishing techniques and methods of end point detection in chemical-mechanical polishing processesMICRON TECHNOLOGY INC·Filed 1994·Granted Aug 8, 1995·204 cites·6 claims
- 0598US5413941AOptical end point detection methods in semiconductor planarizing polishing processesMICRON TECHNOLOGY INC·Filed 1994·Granted May 9, 1995·353 cites·8 claims
- 0698US5377429AMethod and appartus for subliming precursorsMICRON SEMICONDUCTOR INC·Filed 1993·Granted Jan 3, 1995·178 cites·11 claims
- 0798US5341016ALow resistance device element and interconnection structureMICRON SEMICONDUCTOR INC·Filed 1993·Granted Aug 23, 1994·201 cites·18 claims
- 0898US5302233AMethod for shaping features of a semiconductor structure using chemical mechanical planarization (CMP)MICRON SEMICONDUCTOR INC·Filed 1993·Granted Apr 12, 1994·437 cites·18 claims
- 0997US6402884B1Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assembliesMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 11, 2002·94 cites·19 claims
- 1097US6313038B1Method and apparatus for controlling chemical interactions during planarization of microelectronic substratesMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 6, 2001·116 cites·66 claims
- 1197US5609718AMethod and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1995·Granted Mar 11, 1997·160 cites·3 claims
- 1296US6579799B2Method and apparatus for controlling chemical interactions during planarization of microelectronic substratesMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 17, 2003·93 cites·55 claims
- 1396US6548407B1Method and apparatus for controlling chemical interactions during planarization of microelectronic substratesMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 15, 2003·93 cites·84 claims
- 1496US6358122B1Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasivesMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 19, 2002·131 cites·8 claims
- 1596US6273786B1Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive padMICRON TECHNOLOGY INC·Filed 1999·Granted Aug 14, 2001·206 cites·19 claims
- 1696US5795495AMethod of chemical mechanical polishing for dielectric layersMICRON TECHNOLOGY INC·Filed 1995·Granted Aug 18, 1998·205 cites·12 claims
- 1795US7276446B2Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assembliesMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 2, 2007·63 cites·8 claims
- 1895US6488575B2Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machinesMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 3, 2002·39 cites·43 claims
- 1995US6206759B1Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machinesMICRON TECHNOLOGY INC·Filed 1998·Granted Mar 27, 2001·146 cites·56 claims
- 2095US5980363AUnder-pad for chemical-mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 9, 1999·126 cites·17 claims
- 2195US5795218APolishing pad with elongated microcolumnsMICRON TECHNOLOGY INC·Filed 1996·Granted Aug 18, 1998·153 cites·17 claims
- 2294US6331135B1Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasivesMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 18, 2001·101 cites·25 claims
- 2394US6331488B1Planarization process for semiconductor substratesMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 18, 2001·123 cites·54 claims
- 2494US5801066AMethod and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1997·Granted Sep 1, 1998·105 cites·27 claims
- 2594US5691235AMethod of depositing tungsten nitride using a source gas comprising siliconMICRON TECHNOLOGY INC·Filed 1996·Granted Nov 25, 1997·113 cites·14 claims
- 2693US6582281B2Semiconductor processing methods of removing conductive materialMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 24, 2003·49 cites·38 claims
- 2792US6361832B1Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machinesMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 26, 2002·72 cites·12 claims
- 2892US6176763B1Method and apparatus for uniformly planarizing a microelectronic substrateMICRON TECHNOLOGY INC·Filed 1999·Granted Jan 23, 2001·89 cites·78 claims
- 2992US5989470AMethod for making polishing pad with elongated microcolumnsMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 23, 1999·102 cites·8 claims
- 3092US5655951AMethod for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1995·Granted Aug 12, 1997·215 cites·15 claims
- 3192US5254499AMethod of depositing high density titanium nitride films on semiconductor wafersMICRON TECHNOLOGY INC·Filed 1992·Granted Oct 19, 1993·97 cites·25 claims
- 3291US5916819APlanarization fluid composition chelating agents and planarization method using sameMICRON TECHNOLOGY INC·Filed 1996·Granted Jun 29, 1999·87 cites·5 claims
- 3391US5395801AChemical-mechanical polishing processes of planarizing insulating layersMICRON SEMICONDUCTOR INC·Filed 1993·Granted Mar 7, 1995·129 cites·36 claims
- 3489US5449314AMethod of chimical mechanical polishing for dielectric layersMICRON TECHNOLOGY INC·Filed 1994·Granted Sep 12, 1995·216 cites·18 claims
- 3589US5231306ATitanium/aluminum/nitrogen material for semiconductor devicesMICRON TECHNOLOGY INC·Filed 1992·Granted Jul 27, 1993·98 cites·10 claims
- 3688US6605539B2Electro-mechanical polishing of platinum container structureMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 12, 2003·35 cites·33 claims
- 3787US5698455AMethod for predicting process characteristics of polyurethane padsMICRON TECHNOLOGIES INC·Filed 1995·Granted Dec 16, 1997·54 cites·30 claims
- 3885US6867448B1Electro-mechanically polished structureMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 15, 2005·26 cites·13 claims
- 3984US6136218APlanarization fluid composition including chelating agentsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 24, 2000·48 cites·9 claims
- 4083US7078308B2Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrateMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 18, 2006·21 cites·28 claims
- 4183US6395620B1Method for forming a planar surface over low density field areas on a semiconductor waferMICRON TECHNOLOGY INC·Filed 1996·Granted May 28, 2002·70 cites·30 claims
- 4282US6561878B2Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing padsMICRON TECHNOLOGY INC·Filed 2001·Granted May 13, 2003·13 cites·27 claims
- 4381US7160176B2Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrateMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 9, 2007·10 cites·51 claims
- 4481US6630403B2Reduction of surface roughness during chemical mechanical planarization (CMP)MICRON TECHNOLOGY INC·Filed 2002·Granted Oct 7, 2003·20 cites·44 claims
- 4581US6114706AMethod and apparatus for predicting process characteristics of polyurethane padsMICRON TECHNOLOGY INC·Filed 1997·Granted Sep 5, 2000·46 cites·11 claims
- 4679US5892281ATantalum-aluminum-nitrogen material for semiconductor devicesMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 6, 1999·36 cites·20 claims
- 4778US7220166B2Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrateMICRON TECHNOLOGY INC·Filed 2002·Granted May 22, 2007·16 cites·45 claims
- 4878US6964602B2Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing padsMICRON TECHNOLOGY INC·Filed 2004·Granted Nov 15, 2005·10 cites·3 claims
- 4978US6736926B2Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaningMICRON TECHNOLOGY INC·Filed 2001·Granted May 18, 2004·16 cites·21 claims
- 5077US7094131B2Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive materialMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 22, 2006·11 cites·49 claims
Showing the top 50 of 142 patent records by PatentIndex Score.
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