Inventor · disambiguated record

Rebecca Leghziel

Also filed as: LEGHZIEL REBECCA

1 granted patent·0 citations·filing 2021–2021

10Inventor score

Technology areasH10W

Files withECOLE POLYTECHNIQUE FED LAUSANNE EPFL1

Top patents by PatentIndex Score

1 record

0145US11735478B2System and method for removing scalloping and tapering effects in high aspect ratio through-silicon vias of wafersECOLE POLYTECHNIQUE FED LAUSANNE EPFL·Filed 2021·Granted Aug 22, 2023·0 cites·9 claims

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