Inventor · disambiguated record
Min Jae Seong
Also filed as: SEONG MIN JAE
6 granted patents·4 pending applications·14 citations·filing 2015–2023
75Inventor score
Files withSAMSUNG ELECTRO MECH10
Top patents by PatentIndex Score
10 records- 0183US10950587B2Printed circuit board and package structureSAMSUNG ELECTRO MECH·Filed 2019·Granted Mar 16, 2021·7 cites·22 claims
- 0278US11382213B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2021·Granted Jul 5, 2022·1 cites·22 claims
- 0377US9793250B2Package board, method for manufacturing the same and package on package having the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Oct 17, 2017·3 cites·10 claims
- 0473US9699885B2Circuit board including heat dissipation structureSAMSUNG ELECTRO MECH·Filed 2015·Granted Jul 4, 2017·2 cites·17 claims
- 0564US10064291B2Circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2015·Granted Aug 28, 2018·1 cites·8 claims
- 0651US2024021486A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 0746US2023199974A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2022·Application pending·0 cites
- 0839US9992865B2Circuit board and assembly thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 5, 2018·0 cites·7 claims
- 0933US2016095203A1Circuit boardSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 1033US2015342046A1Printed circuit board, method for maufacturing the same and package on package having the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →