Inventor

KANG TECKGYU

US37 patents

⚠️ This page may combine multiple inventors who share the name “KANG TECKGYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KANG TECKGYU

GOOGLE LLC

Cooling electronic devices in a data center

Cooling electronic devices in a data center

Package stiffener for protecting semiconductor die

Cooling electronic devices in a data center

Cooling electronic devices in a data center

High bandwidth memory package for high performance processors

Backside integrated voltage regulator for integrated circuits

Embedded air gap transmission lines

Methods and heat distribution devices for thermal management of chip assemblies

Device and method for direct liquid cooling via metal channels

Deep trench capacitors embedded in package substrate

Three dimensional IC package with thermal enhancement

Backside integrated voltage regulator for integrated circuits

ASIC package with photonics and vertical power delivery

Integrated circuit package for high bandwidth memory

Backside integrated voltage regulator for integrated circuits

Backside interconnection interface die for integrated circuits package

Integrated circuit package for high bandwidth memory

ASIC package with photonics and vertical power delivery

Three dimensional IC package with thermal enhancement

Backside integrated voltage regulator for integrated circuits

Integrated circuit package for high bandwidth memory

Integrated circuit substrate for containing liquid adhesive bleed-out

ASIC package with photonics and vertical power delivery

Wafer level fan-out application specific integrated circuit bridge memory stack

Massive deep trench capacitor die fill for high performance application specific integrated circuit (ASIC) applications

High bandwidth memory package for high performance processors

Package stiffener for protecting semiconductor die

Methods and heat distribution devices for thermal management of chip assemblies

Deep trench capacitors embedded in package substrate

Temperature control element utilized in device die packages

Socket to support high performance multi-die ASICs

Integrated circuit substrate for containing liquid adhesive bleed-out

Active silicon D2D bridge

NVIDIA CORP

Chip package using interposer substrate with through-silicon vias

System, method, and computer program product for a cavity package-on-package structure

GOOGLE INC

Integration of silicon photonics IC for high data rate