Inventor · disambiguated record
Jane Hui
Also filed as: HUI JANE · HUI JANE C M
4 granted patents·1 pending application·57 citations·filing 1999–2013
75Inventor score
Technology areasH10P
Top patents by PatentIndex Score
5 records- 0187US7585768B2Combined copper plating method to improve gap fillCHARTERED SEMICONDUCTOR MFG·Filed 2006·Granted Sep 8, 2009·14 cites·12 claims
- 0272US9054107B2Reliable interconnect for semiconductor deviceGLOBALFOUNDRIES SG PTE LTD·Filed 2013·Granted Jun 9, 2015·2 cites·20 claims
- 0372US6207554B1Gap filling process in integrated circuits using low dielectric constant materialsCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted Mar 27, 2001·39 cites·22 claims
- 0468US8598031B2Reliable interconnect for semiconductor deviceZHANG FAN·Filed 2009·Granted Dec 3, 2013·2 cites·21 claims
- 0538US2001012687A1Gap filling process in integrated circuits using low dielectric constant materialsCHARTERED SEMICONDUCTOR MFG·Filed 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →