Inventor · disambiguated record
Ming-Shih Tsai
Also filed as: TSAI MING-SHIH
8 granted patents·6 pending applications·119 citations·filing 1997–2021
85Inventor score
Files withVERSUM MAT US LLC4CABOT MICROELECTRONICS CORP2DE REGE THESAURO FRANCESCO1IND TECH RES INST1MOEGGENBORG KEVIN1
Top patents by PatentIndex Score
14 records- 0192US5922091AChemical mechanical polishing slurry for metallic thin filmNAT SCIENCE COUNCIL REPUBLIC CHINA·Filed 1997·Granted Jul 13, 1999·89 cites·14 claims
- 0279US11401441B2Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applicationsVERSUM MAT US LLC·Filed 2018·Granted Aug 2, 2022·4 cites·2 claims
- 0378US8691695B2CMP compositions and methods for suppressing polysilicon removal ratesMOEGGENBORG KEVIN·Filed 2010·Granted Apr 8, 2014·5 cites·6 claims
- 0469US11718767B2Chemical mechanical planarization composition for polishing oxide materials and method of use thereofVERSUM MAT US LLC·Filed 2019·Granted Aug 8, 2023·1 cites·15 claims
- 0569US8529680B2Compositions for CMP of semiconductor materialsDE REGE THESAURO FRANCESCO·Filed 2010·Granted Sep 10, 2013·2 cites·25 claims
- 0662US7803203B2Compositions and methods for CMP of semiconductor materialsCABOT MICROELECTRONICS CORP·Filed 2007·Granted Sep 28, 2010·1 cites·25 claims
- 0749US6174454B1Slurry formulation for selective CMP of organic spin-on-glass insulating layer with low dielectric constantNAT SCIENCE COUNCIL·Filed 1999·Granted Jan 16, 2001·13 cites·9 claims
- 0849US2024006189A1Chemical Mechanical Planarization (CMP) For Copper And Through-Silicon Via (TSV)VERSUM MAT US LLC·Filed 2021·Application pending·0 cites
- 0946US6555424B2Thin film transistor with sub-gates and schottky source/drain and a manufacturing method of the sameS M SZE·Filed 2001·Granted Apr 29, 2003·4 cites·9 claims
- 1045US2022332978A1Low Dishing Copper Chemical Mechanical PlanarizationVERSUM MAT US LLC·Filed 2020·Application pending·0 cites
- 1143US2014197356A1Cmp compositions and methods for suppressing polysilicon removal ratesCABOT MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1241US2007144075A1Chemical mechanical polishing particles and slurry and method of producing the sameIND TECH RES INST·Filed 2006·Application pending·0 cites
- 1336US2003157804A1Composition for the chemical mechanical polishing of metal and metal/dielectric structuresFiled 2002·Application pending·0 cites
- 1434US2002106900A1Polishing slurry for the chemical-mechanical polishing of metal and dielectric structuresFiled 2001·Application pending·0 cites
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