Inventor · disambiguated record
Yung-Cheol Kong
Also filed as: KONG YUNG-CHEOL
17 granted patents·5 pending applications·108 citations·filing 2005–2024
92Inventor score
Top patents by PatentIndex Score
22 records- 0193US12057366B2Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 6, 2024·1 cites·20 claims
- 0293US11600545B2Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·2 cites·19 claims
- 0390US7379113B2Image sensor module having auto-aligned lens, and method of fabricating the same, and method of automatically controlling focus of lensSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 27, 2008·32 cites·22 claims
- 0486US11069592B2Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 20, 2021·3 cites·20 claims
- 0586US8139145B2Camera moduleRYU HAN-SUNG·Filed 2008·Granted Mar 20, 2012·14 cites·17 claims
- 0684US7863702B2Image sensor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 4, 2011·16 cites·24 claims
- 0782US7494292B2Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structureSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 24, 2009·15 cites·37 claims
- 0881US2024363472A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0979US10964618B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 30, 2021·3 cites·20 claims
- 1077US7484901B2Image sensor camera module and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 3, 2009·8 cites·15 claims
- 1176US8902356B2Image sensor module having image sensor packageSEO BYOUNG-RIM·Filed 2011·Granted Dec 2, 2014·7 cites·17 claims
- 1269US7972889B2Methods of fabricating camera modules including aligning lenses on transparent substrates with image sensor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jul 5, 2011·2 cites·20 claims
- 1369US7550812B2Camera module and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 23, 2009·2 cites·10 claims
- 1465US10105102B2Package for processing sensed-data, sensed-data processor, and system for processing sensed-dataSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 23, 2018·1 cites·10 claims
- 1563US8053714B2Image sensor module, camera module including the same and electronic device including the camera moduleSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 8, 2011·2 cites·19 claims
- 1654US8927316B2Camera module and method of manufacturing the camera moduleSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 6, 2015·0 cites·6 claims
- 1752US2010129954A1Photographic modules and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1843US8203130B2Image sensor module, method of manufacturing the same, camera module including the same and electronic device including the camera moduleKONG YUNG-CHEOL·Filed 2011·Granted Jun 19, 2012·0 cites·7 claims
- 1942US8547471B2Camera module and method of manufacturing the camera moduleCHO YONG-HOE·Filed 2011·Granted Oct 1, 2013·0 cites·14 claims
- 2040US2012105706A1Photographic modules and methods of forming the sameKONG YUNG-CHEOL·Filed 2012·Application pending·0 cites
- 2139US2005258502A1Chip package, image sensor module including chip package, and manufacturing method thereofKONG YUNG-CHEOL·Filed 2005·Application pending·0 cites
- 2234US2012038813A1Camera moduleJUNG YOUNG-GYU·Filed 2011·Application pending·0 cites
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