Inventor · disambiguated record
Hoi P. Le
Also filed as: LE HOI P
4 granted patents·1 pending application·75 citations·filing 2000–2005
79Inventor score
Top patents by PatentIndex Score
5 records- 0191US6530653B2Ultrasonic bonding of ink-jet print head componentsPICOJET INC·Filed 2001·Granted Mar 11, 2003·52 cites·25 claims
- 0267US6464324B1Microfluid device and ultrasonic bonding processPICOJET INC·Filed 2000·Granted Oct 15, 2002·10 cites·19 claims
- 0363US6928731B2Ultrasonic bonding process for making a microfluid devicePICOJET INC·Filed 2004·Granted Aug 16, 2005·8 cites·9 claims
- 0456US6783213B2Microfluid device and ultrasonic bonding processPICOJET INC·Filed 2002·Granted Aug 31, 2004·5 cites·7 claims
- 0532US2006050109A1Low bonding temperature and pressure ultrasonic bonding process for making a microfluid deviceLE HUE P·Filed 2005·Application pending·0 cites
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