Inventor · disambiguated record
Chien-Jung Wang
Also filed as: WANG CHIEN-JUNG
36 granted patents·4 pending applications·390 citations·filing 1998–2024
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG22TAIWAN SEMICONDUCTOR MFG CO LTD8WANG CHIEN-JUNG3FORMOSA PLASTICS CORP1TAIWAN SEMICONDUCTOR MFG CORP1
Top patents by PatentIndex Score
40 records- 0197US7485912B2Flexible metal-oxide-metal capacitor designTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Feb 3, 2009·67 cites·21 claims
- 0296US7893459B2Seal ring structures with reduced moisture-induced reliability degradationTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Feb 22, 2011·33 cites·15 claims
- 0393US6617180B1Test structure for detecting bridging of DRAM capacitorsTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Sep 9, 2003·69 cites·13 claims
- 0487US7504731B2Interconnect structure to reduce stress induced voiding effectTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Mar 17, 2009·9 cites·6 claims
- 0587US6815971B2Method and apparatus for stress testing integrated circuits using an adjustable AC hot carrier injection sourceTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 9, 2004·77 cites·13 claims
- 0685US8729705B2Seal ring structures with reduced moisture-induced reliability degradationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 20, 2014·5 cites·20 claims
- 0781US7851793B2Test structure with TDDB test patternTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Dec 14, 2010·13 cites·20 claims
- 0877US7646207B2Method for measuring a property of interconnections and structure for the sameTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jan 12, 2010·7 cites·20 claims
- 0975US8674508B2Seal ring structures with reduced moisture-induced reliability degradationWANG CHIEN-JUNG·Filed 2011·Granted Mar 18, 2014·3 cites·15 claims
- 1074US11798860B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·20 claims
- 1174US8227923B2Interconnect structure to reduce stress induced voiding effectWANG CHIEN-JUNG·Filed 2011·Granted Jul 24, 2012·2 cites·6 claims
- 1273US8379365B2Metal oxide metal capacitor with slot viasTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 19, 2013·3 cites·20 claims
- 1373US6897475B2Test structure and related methods for evaluating stress-induced voidingTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted May 24, 2005·15 cites·7 claims
- 1471US2025034363A1Sizing agent composition, sizing agent, carbon fiber covered with sizing agent, and composite materialFORMOSA PLASTICS CORP·Filed 2024·Application pending·0 cites
- 1570US10020239B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 10, 2018·1 cites·20 claims
- 1666US12507356B2Waterproof deviceWISTRON NEWEB CORP·Filed 2023·Granted Dec 23, 2025·0 cites·10 claims
- 1765US7227266B2Interconnect structure to reduce stress induced voiding effectTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jun 5, 2007·7 cites·24 claims
- 1865US6258712B1Method for forming a borderless contactTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jul 10, 2001·30 cites·4 claims
- 1964US11037849B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·0 cites·20 claims
- 2064US9502886B2MiM capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 22, 2016·1 cites·20 claims
- 2160US10475719B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 12, 2019·0 cites·20 claims
- 2258US8785323B2Method of forming an interconnect structure having an enlarged regionTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 22, 2014·0 cites·9 claims
- 2357US8013451B2Interconnect structure to reduce stress induced voiding effectTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Sep 6, 2011·0 cites·20 claims
- 2454US8513115B2Method of forming an interconnect structure having an enlarged regionWANG CHIEN-JUNG·Filed 2012·Granted Aug 20, 2013·0 cites·7 claims
- 2554US7301239B2Wiring structure to minimize stress induced void formationTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Nov 27, 2007·7 cites·38 claims
- 2653US10211202B2Method of forming bandgap reference integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 19, 2019·0 cites·20 claims
- 2752US9876008B2Bandgap reference circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 23, 2018·0 cites·20 claims
- 2851US2007109008A1Novel test structure for speeding a stress-induced voiding test and method of using the sameTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 2948US7157925B2Test structure for speeding a stress-induced voiding test and method of using sameTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jan 2, 2007·1 cites·32 claims
- 3048US6934206B2Test structure for detecting bridging of DRAM capacitorsTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Aug 23, 2005·1 cites·7 claims
- 3146US6396751B1Semiconductor device comprising a test structureTAIWAN SEMICONDUCTOR MFG CORP·Filed 2001·Granted May 28, 2002·6 cites·9 claims
- 3245US6277742B1Method of protecting tungsten plug from corrodingTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Aug 21, 2001·11 cites·14 claims
- 3343US9425330B2Metal oxide metal capacitor with slot viasWANG CHIN-SHAN·Filed 2013·Granted Aug 23, 2016·0 cites·20 claims
- 3443US6060786AAlignment-marker structure and method of forming the same in integrated circuit fabricationWORLDWIDE SEMICONDUCTOR MANUFA·Filed 1999·Granted May 9, 2000·10 cites·8 claims
- 3539US9972995B2Circuit with a droop compensating mechanismTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 15, 2018·0 cites·20 claims
- 3639US2008042269A1Bump structures and packaged structures thereofTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 3737US6258694B1Fabrication method of a device isolation structureTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jul 10, 2001·6 cites·22 claims
- 3833US6245667B1Method of forming viaTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jun 12, 2001·3 cites·9 claims
- 3933US6171963B1Method for forming a planar intermetal dielectric using a barrier layerWORLDWIDE SEMICONDUCTOR MFG·Filed 1998·Granted Jan 9, 2001·3 cites·9 claims
- 4030US2002064919A1Method of fabricating gateFiled 1999·Application pending·0 cites
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