Inventor · disambiguated record
Masanori Nishiguchi
Also filed as: NISHIGUCHI MASANORI
47 granted patents·2,650 citations·filing 1987–1994
99Inventor score
Files withSUMITOMO ELECTRIC INDUSTRIES47
Top patents by PatentIndex Score
47 records- 0199US5214308ASubstrate for packaging a semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted May 25, 1993·473 cites·21 claims
- 0298US5196726ASubstrate for packaging a semiconductor device having particular terminal and bump structureSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Mar 23, 1993·280 cites·15 claims
- 0394US5406212ABurn-in apparatus and method for self-heating semiconductor devices having built-in temperature sensorsSUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted Apr 11, 1995·123 cites·23 claims
- 0494US5035087ASurface grinding machineSUMITOMO ELECTRIC INDUSTRIES·Filed 1987·Granted Jul 30, 1991·86 cites·1 claims
- 0593US5414370ABurn-in apparatus and method which individually controls the temperature of a plurality of semiconductor devicesSUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted May 9, 1995·103 cites·2 claims
- 0693US4904012ASuction deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1989·Granted Feb 27, 1990·130 cites·5 claims
- 0793US4809704ACatheter type sensorSUMITOMO ELECTRIC INDUSTRIES·Filed 1987·Granted Mar 7, 1989·162 cites·10 claims
- 0889US5188984ASemiconductor device and production method thereofSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Feb 23, 1993·111 cites·4 claims
- 0988US5113622AApparatus for grinding semiconductor waferSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted May 19, 1992·78 cites·23 claims
- 1085US5461261ASemiconductor device with bumpsSUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Oct 24, 1995·80 cites·15 claims
- 1185US5359285AMethod and apparatus for varying temperature and electronic load conditions of a semiconductor device in a burn-in test chamber while performing a burn-in testSUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted Oct 25, 1994·58 cites·27 claims
- 1284US5098501APickup method and the pickup apparatus for chip-type partSUMITOMO ELECTRIC INDUSTRIES·Filed 1990·Granted Mar 24, 1992·86 cites·19 claims
- 1383US4859269AChip mounting apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 1988·Granted Aug 22, 1989·62 cites·3 claims
- 1482US5387815ASemiconductor chip moduleSUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted Feb 7, 1995·60 cites·16 claims
- 1582US5064782AMethod of adhesively and hermetically sealing a semiconductor package lid by scrubbingSUMITOMO ELECTRIC INDUSTRIES·Filed 1990·Granted Nov 12, 1991·70 cites·3 claims
- 1678US5327075ABurn-in apparatus and method for semiconductor devicesSUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted Jul 5, 1994·38 cites·20 claims
- 1777US5298460ASubstrate for packaging a semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted Mar 29, 1994·47 cites·6 claims
- 1876US4825684AMethod of testing semiconductor pressure sensorSUMITOMO ELECTRIC INDUSTRIES·Filed 1987·Granted May 2, 1989·33 cites·7 claims
- 1975US5302854APackaging structure of a semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Apr 12, 1994·42 cites·17 claims
- 2073US5324381ASemiconductor chip mounting method and apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 1993·Granted Jun 28, 1994·39 cites·28 claims
- 2172US5401099AMethod of measuring junction temperatureSUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted Mar 28, 1995·54 cites·3 claims
- 2270US5536974ASemiconductor device with light reflecting substrate areaSUMITOMO ELECTRIC INDUSTRIES·Filed 1993·Granted Jul 16, 1996·45 cites·18 claims
- 2369US5212880AApparatus for packaging a semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted May 25, 1993·41 cites·5 claims
- 2467US4908693AWiring structure of semiconductor pressure sensorSUMITOMO ELECTRIC INDUSTRIES·Filed 1987·Granted Mar 13, 1990·23 cites·6 claims
- 2562US5122481ASemiconductor element manufacturing process using sequential grinding and chemical etching stepsSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Jun 16, 1992·32 cites·3 claims
- 2660US4868974AChip mounting apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 1988·Granted Sep 26, 1989·24 cites·3 claims
- 2759US5525835ASemiconductor chip module having an electrically insulative thermally conductive thermal dissipator directly in contact with the semiconductor elementSUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Jun 11, 1996·26 cites·16 claims
- 2859US4965247ASuperconducting coil and a method for producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1988·Granted Oct 23, 1990·17 cites·18 claims
- 2958US5339215AHeat sink, method of manufacturing the same, and device of manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted Aug 16, 1994·20 cites·18 claims
- 3057US5092033AMethod for packaging semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Mar 3, 1992·21 cites·7 claims
- 3157US4809536AMethod of adjusting bridge circuit of semiconductor pressure sensorSUMITOMO ELECTRIC INDUSTRIES·Filed 1987·Granted Mar 7, 1989·16 cites·3 claims
- 3256US5262355AMethod for packaging a semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1993·Granted Nov 16, 1993·26 cites·5 claims
- 3353US5384000ASemiconductor chip mounting method and apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Jan 24, 1995·17 cites·28 claims
- 3450US5348214AMethod of mounting semiconductor elementsSUMITOMO ELECTRIC INDUSTRIES·Filed 1993·Granted Sep 20, 1994·15 cites·2 claims
- 3549US5165791AMethod and apparatus for measuring temperature based on infrared lightSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Nov 24, 1992·14 cites·13 claims
- 3649US5104023AApparatus for fabrication semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Apr 14, 1992·15 cites·4 claims
- 3747US4937226AMethod for producing a small superconducting solenoidSUMITOMO ELECTRIC INDUSTRIES·Filed 1988·Granted Jun 26, 1990·7 cites·12 claims
- 3842US5244142AMethod of mounting semiconductor elementsSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Sep 14, 1993·10 cites·5 claims
- 3941US5105242AField effect transistor having schottky contact and a high frequency characteristicSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Apr 14, 1992·11 cites·2 claims
- 4041US4981809AMethod of forming a mask pattern for the production of transistorSUMITOMO ELECTRIC INDUSTRIES·Filed 1988·Granted Jan 1, 1991·12 cites·4 claims
- 4140US5525548AProcess of fixing a heat sink to a semiconductor chip and package capSUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Jun 11, 1996·8 cites·6 claims
- 4239US5447750AHeat sink method of manufacturing the same and device of manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Sep 5, 1995·7 cites·8 claims
- 4339US5403400AHeat sink method of manufacturing the same and device of manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Apr 4, 1995·7 cites·5 claims
- 4439US4844325AMethod and apparatus for die-bonding semiconductor chip bondingSUMITOMO ELECTRIC INDUSTRIES·Filed 1988·Granted Jul 4, 1989·9 cites·7 claims
- 4538US5157479ASemiconductor device being capable of improving the packing density with a high heat radiation characteristicsSUMITOMO ELECTRIC INDUSTRIES·Filed 1990·Granted Oct 20, 1992·9 cites·10 claims
- 4632US5019875ASemiconductor device radiation hardened MESFETSUMITOMO ELECTRIC INDUSTRIES·Filed 1990·Granted May 28, 1991·2 cites·28 claims
- 4730US5027170ASemiconductor device MESFET with upper and lower layersSUMITOMO ELECTRIC INDUSTRIES·Filed 1990·Granted Jun 25, 1991·1 cites·28 claims
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