Inventor · disambiguated record
Hisao Masuda
Also filed as: MASUDA HISAO
6 granted patents·97 citations·filing 1988–1994
84Inventor score
Files withMITSUBISHI ELECTRIC CORP6
Top patents by PatentIndex Score
6 records- 0164US4877173AWire bonding apparatusMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Oct 31, 1989·31 cites·7 claims
- 0254US5481137ASemiconductor device with improved immunity to contact and conductor defectsMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Jan 2, 1996·20 cites·4 claims
- 0353US4916397ASemiconductor device with bonding padMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Apr 10, 1990·22 cites·6 claims
- 0437US5087590AMethod of manufacturing semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Feb 11, 1992·10 cites·12 claims
- 0534US5260604ASemiconductor device with improved immunity to contact and conductor defectsMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Nov 9, 1993·6 cites·4 claims
- 0634US4982728AApparatus for assembling semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Jan 8, 1991·8 cites·8 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →