Inventor · disambiguated record
Motohiro Arifuku
Also filed as: ARIFUKU MOTOHIRO
27 granted patents·17 pending applications·330 citations·filing 1998–2023
96Inventor score
Files withHITACHI CHEMICAL CO LTD24ARIFUKU MOTOHIRO10SHOWA DENKO MATERIALS CO LTD3FUJINAWA TOHRU2RESONAC CORP2
Top patents by PatentIndex Score
44 records- 0194US7629050B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2007·Granted Dec 8, 2009·11 cites·8 claims
- 0294US7241644B2Adhesive, method of connecting wiring terminals and wiring structureHITACHI CHEMICAL CO LTD·Filed 2005·Granted Jul 10, 2007·28 cites·12 claims
- 0393US7141645B2Wiring-connecting material and wiring-connected board production process using the sameHITACHI CHEMICAL CO LTD·Filed 2004·Granted Nov 28, 2006·36 cites·6 claims
- 0491US6939913B1Adhesive agent, method of connecting wiring terminals and wiring structureHITACHI CHEMICAL CO LTD·Filed 2000·Granted Sep 6, 2005·30 cites·13 claims
- 0590US7604868B2Electronic circuit including circuit-connecting materialHITACHI CHEMICAL CO LTD·Filed 2005·Granted Oct 20, 2009·16 cites·10 claims
- 0690US7553890B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2007·Granted Jun 30, 2009·11 cites·9 claims
- 0788US6777464B1Circuit connecting material, and structure and method of connecting circuit terminalHITACHI CHEMICAL CO LTD·Filed 1998·Granted Aug 17, 2004·86 cites·15 claims
- 0887US8115322B2Adhesive, method of connecting wiring terminals and wiring structureARIFUKU MOTOHIRO·Filed 2010·Granted Feb 14, 2012·6 cites·13 claims
- 0987US7777335B2Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particlesHITACHI CHEMICAL CO LTD·Filed 2005·Granted Aug 17, 2010·11 cites·16 claims
- 1086US7618713B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2005·Granted Nov 17, 2009·11 cites·8 claims
- 1185US6762249B1Wiring-connecting material and process for producing circuit board with the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Jul 13, 2004·39 cites·21 claims
- 1279US8043709B2Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the sameHITACHI CHEMICAL CO LTD·Filed 2004·Granted Oct 25, 2011·23 cites·13 claims
- 1375US8120189B2Wiring terminal-connecting adhesiveARIFUKU MOTOHIRO·Filed 2008·Granted Feb 21, 2012·1 cites·13 claims
- 1475US7968196B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2007·Granted Jun 28, 2011·1 cites·24 claims
- 1572US8202622B2Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the sameARIFUKU MOTOHIRO·Filed 2009·Granted Jun 19, 2012·4 cites·9 claims
- 1667US8132319B2Circuit connecting methodARIFUKU MOTOHIRO·Filed 2008·Granted Mar 13, 2012·3 cites·12 claims
- 1767US7629056B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2004·Granted Dec 8, 2009·12 cites·9 claims
- 1866US2025382468A1Particle dispersionRESONAC CORP·Filed 2023·Application pending·0 cites
- 1965US7879956B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2007·Granted Feb 1, 2011·0 cites·18 claims
- 2059US11884641B2Method for decomposing flavonoid glycoside and method for producing flavonoidSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jan 30, 2024·0 cites·10 claims
- 2159US8497431B2Circuit connection material, circuit member connecting structure and method of connecting circuit memberARIFUKU MOTOHIRO·Filed 2006·Granted Jul 30, 2013·0 cites·20 claims
- 2259US7967943B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2005·Granted Jun 28, 2011·0 cites·92 claims
- 2359US2023391983A1PasteSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 2457US12195436B2Method for decomposing flavonoid glycoside and method for producing flavonoidSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jan 14, 2025·0 cites·9 claims
- 2553US2013140083A1Adhesive composition, film-like adhesive, adhesive sheet, circuit connection structure, method for connecting circuit members, use of adhesive composition, use of film-like adhesive and use of adhesive sheetHITACHI CHEMICAL CO LTD·Filed 2012·Application pending·0 cites
- 2652US8142605B2Circuit-connecting material and circuit terminal connected structure and connecting methodWATANABE ITSUO·Filed 2011·Granted Mar 27, 2012·0 cites·27 claims
- 2750US8501045B2Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the sameARIFUKU MOTOHIRO·Filed 2011·Granted Aug 6, 2013·0 cites·20 claims
- 2849US8541688B2Circuit connection material, circuit member connecting structure and method of connecting circuit memberARIFUKU MOTOHIRO·Filed 2010·Granted Sep 24, 2013·1 cites·17 claims
- 2949US2006252843A1Wiring-connecting material and wiring-connected board production process using the sameFUJINAWA TOHRU·Filed 2006·Application pending·0 cites
- 3048US2010307805A1Circuit connecting material, connection structure and method for producing the sameHITACHI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 3148US2010265685A1Wiring-connecting material and wiring-connected board production process using the sameFUJINAWA TOHRU·Filed 2010·Application pending·0 cites
- 3248US2010277884A1Circuit-connecting material and circuit terminal connection structureHITACHI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 3347US2010139947A1Circuit-connecting material, and connection structure for circuit memberHITACHI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 3446US2024224413A1Wiring substrateRESONAC CORP·Filed 2021·Application pending·0 cites
- 3542US2010243303A1Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit memberHITACHI CHEMICAL CO LTD·Filed 2007·Application pending·0 cites
- 3642US2010025097A1Circuit connection structureHITACHI CHEMICAL CO LTD·Filed 2007·Application pending·0 cites
- 3740US2011267791A1Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection materialHITACHI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 3839US8558118B2Circuit connection material, circuit member connecting structure and method of connecting circuit memberARIFUKU MOTOHIRO·Filed 2010·Granted Oct 15, 2013·0 cites·15 claims
- 3939US2010140556A1Filmy adhesive for circuit connectionHITACHI CHEMICAL CO LTD·Filed 2007·Application pending·0 cites
- 4037US6818086B2Method for repairing circuit connection part, and structure and method for connecting circuit terminal of circuit repaired by the methodHITACHI CHEMICAL CO LTD·Filed 2001·Granted Nov 16, 2004·0 cites·13 claims
- 4137US2012015126A1Adhesive material reelTATSUZAWA TAKASHI·Filed 2010·Application pending·0 cites
- 4237US2012138868A1Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit memberARIFUKU MOTOHIRO·Filed 2010·Application pending·0 cites
- 4337US2012097902A1Anisotropic conductive particlesARIFUKU MOTOHIRO·Filed 2010·Application pending·0 cites
- 4437US2011300326A1Adhesive material reelTATSUZAWA TAKASHI·Filed 2010·Application pending·0 cites
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