Inventor · disambiguated record

Yousuke Oyama

Also filed as: OYAMA YOUSUKE

1 granted patent·5 citations·filing 2005–2005

26Inventor score

Technology areasB29L

Files withMATSUI MFG CO1

Top patents by PatentIndex Score

1 record

0168US7866352B2Filling method and filling apparatus of powder-particle material in compression moldingMATSUI MFG CO·Filed 2005·Granted Jan 11, 2011·5 cites·14 claims

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