Inventor · disambiguated record
Suresh K. Chengalva
Also filed as: CHENGALVA SURESH · CHENGALVA SURESH K
21 granted patents·8 pending applications·534 citations·filing 2002–2023
96Inventor score
Files withDELPHI TECH INC20BRANDENBURG SCOTT D2ROCKLEY PHOTONICS LTD2CHAMARTIN LABORATORIES LLC1CHENGALVA SURESH K1
Top patents by PatentIndex Score
29 records- 0198US7307841B2Electronic package and method of cooling electronicsDELPHI TECH INC·Filed 2005·Granted Dec 11, 2007·89 cites·21 claims
- 0295US7485957B2Fluid cooled encapsulated microelectronic packageDELPHI TECH INC·Filed 2007·Granted Feb 3, 2009·28 cites·1 claims
- 0395US7334243B2Vane integration into motor hub to enhance CD coolingDELPHI TECH INC·Filed 2005·Granted Feb 19, 2008·26 cites·21 claims
- 0494US7352585B2Flip chip heat sink package and methodDELPHI TECH INC·Filed 2006·Granted Apr 1, 2008·37 cites·16 claims
- 0594US6807731B2Method for forming an electronic assemblyDELPHI TECH INC·Filed 2002·Granted Oct 26, 2004·65 cites·14 claims
- 0693US7180745B2Flip chip heat sink package and methodDELPHI TECH INC·Filed 2003·Granted Feb 20, 2007·77 cites·10 claims
- 0790US7486515B2Fluid circulator for fluid cooled electronic deviceDELPHI TECH INC·Filed 2007·Granted Feb 3, 2009·20 cites·16 claims
- 0889US7440282B2Heat sink electronic package having compliant pedestalDELPHI TECH INC·Filed 2006·Granted Oct 21, 2008·19 cites·15 claims
- 0987US8026597B2Fluid cooled encapsulated microelectronic packageDELPHI TECH INC·Filed 2008·Granted Sep 27, 2011·10 cites·2 claims
- 1086US8471380B2Fluid cooled encapsulated microelectronic packageBRANDENBURG SCOTT D·Filed 2011·Granted Jun 25, 2013·6 cites·4 claims
- 1186US7365273B2Thermal management of surface-mount circuit devicesDELPHI TECH INC·Filed 2004·Granted Apr 29, 2008·39 cites·9 claims
- 1286US7205653B2Fluid cooled encapsulated microelectronic packageDELPHI TECH INC·Filed 2004·Granted Apr 17, 2007·29 cites·8 claims
- 1385US7230832B2Cooled electronic assembly and method for cooling a printed circuit boardDELPHI TECH INC·Filed 2005·Granted Jun 12, 2007·13 cites·20 claims
- 1485US6999317B2Thermally enhanced electronic module with self-aligning heat sinkDELPHI TECH INC·Filed 2003·Granted Feb 14, 2006·43 cites·9 claims
- 1581US7782616B1Heat-dissipating component having stair-stepped coolant channelsDELPHI TECH INC·Filed 2009·Granted Aug 24, 2010·12 cites·7 claims
- 1672US7364684B2Method of making an encapsulated microelectronic package having fluid carrying encapsulant channelsDELPHI TECH INC·Filed 2004·Granted Apr 29, 2008·9 cites·5 claims
- 1766US8797739B2Self circulating heat exchangerBRANDENBURG SCOTT D·Filed 2012·Granted Aug 5, 2014·2 cites·13 claims
- 1862US9726514B2Navigation system that displays other-vehicle informationDELPHI TECH INC·Filed 2015·Granted Aug 8, 2017·2 cites·10 claims
- 1961US12419520B2Wearable deviceCHAMARTIN LABORATORIES LLC·Filed 2023·Granted Sep 23, 2025·0 cites·18 claims
- 2058US7094975B2Circuit board with localized stiffener for enhanced circuit component reliabilityDELPHI TECH INC·Filed 2003·Granted Aug 22, 2006·8 cites·18 claims
- 2154US2022413143A1Sensing systemROCKLEY PHOTONICS LTD·Filed 2022·Application pending·0 cites
- 2249US2024041328A1Minimally invasive device with spectrophotometerROCKLEY PHOTONICS LTD·Filed 2021·Application pending·0 cites
- 2343US2024074667A1SystemROCKLEY PHOTINICS LTD·Filed 2022·Application pending·0 cites
- 2442US2005081377A1Method for forming an electronic assemblyDELPHI TECH INC·Filed 2004·Application pending·0 cites
- 2540US2006209516A1Electronic assembly with integral thermal transient suppressionCHENGALVA SURESH K·Filed 2005·Application pending·0 cites
- 2638US6979900B2Integrated circuit package with integral leadframe convector and method thereforDELPHI TECH INC·Filed 2003·Granted Dec 27, 2005·0 cites·18 claims
- 2738US2020023840A1Driver assistance systemDELPHI TECH INC·Filed 2017·Application pending·0 cites
- 2836US2005077614A1Semiconductor device heat sink package and methodFiled 2003·Application pending·0 cites
- 2935US2005163966A1Surface mounting of componentsFiled 2004·Application pending·0 cites
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