Inventor · disambiguated record
Aminuddin Ismail
Also filed as: ISMAIL AMINUDDIN
3 granted patents·4 pending applications·33 citations·filing 2002–2007
69Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0184US7554185B2Flip chip and wire bond semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jun 30, 2009·21 cites·9 claims
- 0272US8643172B2Heat spreader for center gate moldingFOONG CHEE SENG·Filed 2007·Granted Feb 4, 2014·6 cites·5 claims
- 0371US7432130B2Method of packaging semiconductor die without lead frame or substrateFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Oct 7, 2008·6 cites·12 claims
- 0437US2007026573A1Method of making a stacked die packageISMAIL AMINUDDIN·Filed 2005·Application pending·0 cites
- 0533US2007202680A1Semiconductor packaging methodISMAIL AMINUDDIN·Filed 2006·Application pending·0 cites
- 0632US2003230796A1Stacked die semiconductor deviceFiled 2002·Application pending·0 cites
- 0729US2003160311A1Stacked die semiconductor deviceFiled 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →