Inventor · disambiguated record

Gerry Balanon

Also filed as: BALANON GERRY

5 granted patents·284 citations·filing 2001–2004

84Inventor score

Technology areasH10W

Files withST ASSEMBLY TEST SERVICES PTE3 ST ASSEMBLY TEST SERVICE LTD1 ST ASSEMBLY TEST SERVICES LTD1

Top patents by PatentIndex Score

5 records

0196US6599779B2PBGA substrate for anchoring heat sinkST ASSEMBLY TEST SERVICE LTD·Filed 2001·Granted Jul 29, 2003·130 cites·11 claims
0294US6534859B1Semiconductor package having heat sink attached to pre-molded cavities and method for creating the packageST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Mar 18, 2003·118 cites·63 claims
0372US6706563B2Heat spreader interconnect methodology for thermally enhanced PBGA packagesST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted Mar 16, 2004·18 cites·36 claims
0467US7446408B2Semiconductor package with heat sinkST ASSEMBLY TEST SERVICES PTE·Filed 2003·Granted Nov 4, 2008·12 cites·20 claims
0555US6818981B2Heat spreader interconnect for thermally enhanced PBGA packagesST ASSEMBLY TEST SERVICES PTE·Filed 2004·Granted Nov 16, 2004·6 cites·11 claims

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