Inventor · disambiguated record
Mudasir Ahmad
Also filed as: AHMAD MUDASIR
23 granted patents·5 pending applications·189 citations·filing 2002–2024
95Inventor score
Top patents by PatentIndex Score
28 records- 0198US11990598B1Heat activated multiphase fluid-operated pump for battery temperature controlHAMFOP TECH LLC·Filed 2021·Granted May 21, 2024·6 cites·15 claims
- 0298US11737240B1Heat-activated multiphase fluid-operated pump for electronics waste heat removalHAMFOP TECH LLC·Filed 2021·Granted Aug 22, 2023·12 cites·17 claims
- 0395US11898578B1Heat-activated multiphase fluid-operated pumpHAMFOP TECH LLC·Filed 2021·Granted Feb 13, 2024·2 cites·19 claims
- 0490US9086267B2Real time strain sensing solutionCISCO TECH INC·Filed 2013·Granted Jul 21, 2015·10 cites·19 claims
- 0587US11874022B1Heat-activated multiphase fluid-operated pump for geothermal temperature control of structuresHAMFOP TECH LLC·Filed 2021·Granted Jan 16, 2024·1 cites·20 claims
- 0687US7621190B2Method and apparatus for strain monitoring of printed circuit board assembliesCISCO TECH INC·Filed 2006·Granted Nov 24, 2009·18 cites·16 claims
- 0787US6728104B1Methods and apparatus for cooling a circuit board componentCISCO TECH IND·Filed 2002·Granted Apr 27, 2004·43 cites·25 claims
- 0886US7019976B1Methods and apparatus for thermally coupling a heat sink to a circuit board componentCISCO TECH IND·Filed 2003·Granted Mar 28, 2006·54 cites·18 claims
- 0985US12142749B1Heat activated multiphase fluid-operated pump for motor temperature controlHAMFOP TECH LLC·Filed 2023·Granted Nov 12, 2024·0 cites·7 claims
- 1083US7604491B1Techniques for providing electrical and thermal conductivity between electrical components and printed circuit boards using sleeves defining substantially conical shapesCISCO TECH INC·Filed 2008·Granted Oct 20, 2009·12 cites·10 claims
- 1182US12133363B1Heat-activated pump with integrated evaporator for electronic chip heat removalHAMFOP TECH LLC·Filed 2023·Granted Oct 29, 2024·0 cites·14 claims
- 1282US9204548B2Electronic devices mounted on multiple substratesAHMAD MUDASIR·Filed 2012·Granted Dec 1, 2015·6 cites·19 claims
- 1376US8736044B2Lid for an electrical hardware componentAHMAD MUDASIR·Filed 2010·Granted May 27, 2014·4 cites·16 claims
- 1474US10468318B2Stiffener for providing uniformity in microelectronic packagesCISCO TECH INC·Filed 2018·Granted Nov 5, 2019·2 cites·20 claims
- 1574US7797663B2Conductive dome probes for measuring system level multi-GHZ signalsCISCO TECH INC·Filed 2007·Granted Sep 14, 2010·9 cites·20 claims
- 1670US10186839B1Laser with pre-distorted gratingCISCO TECH INC·Filed 2018·Granted Jan 22, 2019·1 cites·20 claims
- 1769US8952523B2Integrated circuit package lid configured for package coplanarityAHMAD MUDASIR·Filed 2010·Granted Feb 10, 2015·3 cites·14 claims
- 1868US10260782B2Heat dissipation in hermetically-sealed packaged devicesCISCO TECH INC·Filed 2017·Granted Apr 16, 2019·1 cites·20 claims
- 1964US9688453B2Heat dissipation in hermetically-sealed packaged devicesCISCO TECH INC·Filed 2015·Granted Jun 27, 2017·1 cites·20 claims
- 2059US8962388B2Method and apparatus for supporting a computer chip on a printed circuit board assemblyNAGAR MOHAN R·Filed 2011·Granted Feb 24, 2015·1 cites·10 claims
- 2156US2025385151A1Cooling Apparatus And Method Of Manufacturing A Cooling ApparatusGOOGLE LLC·Filed 2024·Application pending·0 cites
- 2255US10230212B1Method and apparatus to prevent laser kink failuresCISCO TECH INC·Filed 2017·Granted Mar 12, 2019·0 cites·19 claims
- 2355US2019207363A1Method and apparatus to prevent laser kink failuresCISCO TECH INC·Filed 2019·Application pending·0 cites
- 2449US2009310318A1Attaching a lead-free component to a printed circuit board under lead-based assembly conditionsCISCO TECH INC·Filed 2008·Application pending·0 cites
- 2547US2015173177A1Method and apparatus for supporting a computer chip on a printed circuit board assemblyCISCO TECH INC·Filed 2015·Application pending·0 cites
- 2646US8081484B2Method and apparatus for supporting a computer chip on a printed circuit board assemblyNAGAR MOHAN R·Filed 2006·Granted Dec 20, 2011·0 cites·13 claims
- 2744US7277297B2Device, apparatus, method and assembly for coupling an electrical component with a circuit boardCISCO TECH INC·Filed 2005·Granted Oct 2, 2007·3 cites·30 claims
- 2836US2013284796A1System in package module assemblyNAGAR MOHAN R·Filed 2012·Application pending·0 cites
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