Inventor · disambiguated record
Heng Keong Yip
Also filed as: YIP HENG K · YIP HENG KEONG
13 granted patents·3 pending applications·72 citations·filing 1993–2021
90Inventor score
Files withFREESCALE SEMICONDUCTOR INC9AMS OSRAM INT GMBH1FOONG CHEE SENG1GAUTHAM VISWANADAM1LEE CHU-CHUNG1
Top patents by PatentIndex Score
16 records- 0186US7473586B1Method of forming flip-chip bump carrier type packageFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jan 6, 2009·15 cites·14 claims
- 0286US7384819B2Method of forming stackable packageFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jun 10, 2008·16 cites·11 claims
- 0383US7741196B2Semiconductor wafer with improved crack protectionFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jun 22, 2010·9 cites·15 claims
- 0480US7531383B2Array quad flat no-lead package and method of forming sameFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted May 12, 2009·9 cites·16 claims
- 0578US7955953B2Method of forming stacked die packageFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jun 7, 2011·8 cites·16 claims
- 0672US8643172B2Heat spreader for center gate moldingFOONG CHEE SENG·Filed 2007·Granted Feb 4, 2014·6 cites·5 claims
- 0764US8791582B2Integrated circuit package with voltage distributorLEE CHU-CHUNG·Filed 2010·Granted Jul 29, 2014·3 cites·17 claims
- 0860US7494924B2Method for forming reinforced interconnects on a substrateFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Feb 24, 2009·2 cites·9 claims
- 0954US7566648B2Method of making solder padFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jul 28, 2009·1 cites·14 claims
- 1053US9331046B2Integrated circuit package with voltage distributorFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted May 3, 2016·0 cites·20 claims
- 1142US7282395B2Method of making exposed pad ball grid array packageFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Oct 16, 2007·0 cites·20 claims
- 1242US2024290696A1Lead frame sheet and optoelectronic semiconductor deviceAMS OSRAM INT GMBH·Filed 2021·Application pending·0 cites
- 1341US11329030B2Production of a chip moduleOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2017·Granted May 10, 2022·0 cites·14 claims
- 1441US2008182120A1Bond pad for semiconductor deviceTAN LAN CHU·Filed 2007·Application pending·0 cites
- 1535US2007281393A1Method of forming a trace embedded packageGAUTHAM VISWANADAM·Filed 2006·Application pending·0 cites
- 1631US5326453AMethod and solution for electrodeposition of a dense, reflective tin or tin-lead alloyMOTOROLA INC·Filed 1993·Granted Jul 5, 1994·3 cites·23 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →