Inventor · disambiguated record
Kyle Fukuchi
Also filed as: Fukuchi Kyle
2 granted patents·34 citations·filing 2015–2017
62Inventor score
Technology areasH04B
Files withGOOGLE INC2
Top patents by PatentIndex Score
2 records- 0195US9641254B1Heat dissipation approach in chip on board assembly by using stacked copper microviasGOOGLE INC·Filed 2015·Granted May 2, 2017·29 cites·14 claims
- 0285US9918377B1Heat dissipation approach in chip on board assembly by using stacked copper MicroviasGOOGLE INC·Filed 2017·Granted Mar 13, 2018·5 cites·16 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →