Inventor · disambiguated record
Andrew Carswell
Also filed as: CARSWELL ANDREW · CARSWELL ANDREW D · CARSWELL ANDREW DENNIS · CARSWELL ANDREW DENNIS WATSON
11 granted patents·4 pending applications·17 citations·filing 2005–2022
84Inventor score
Top patents by PatentIndex Score
15 records- 0182US7967661B2Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufactureMICRON TECHNOLOGY INC·Filed 2008·Granted Jun 28, 2011·9 cites·24 claims
- 0271US7294049B2Method and apparatus for removing material from microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2005·Granted Nov 13, 2007·3 cites·48 claims
- 0370US7628680B2Method and apparatus for removing material from microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2007·Granted Dec 8, 2009·3 cites·24 claims
- 0464US7452816B2Semiconductor processing method and chemical mechanical polishing methodsMICRON TECHNOLOGY INC·Filed 2006·Granted Nov 18, 2008·2 cites·45 claims
- 0560US12347713B2Semiconductor apparatus with an alignment moatMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 1, 2025·0 cites·17 claims
- 0658US10573720B2Methods of forming platinum-containing constructionsMICRON TECHNOLOGY INC·Filed 2017·Granted Feb 25, 2020·0 cites·20 claims
- 0756US9755035B2Platinum-containing constructionsMICRON TECHNOLOGY INC·Filed 2013·Granted Sep 5, 2017·0 cites·5 claims
- 0853US2023361203A1Finfet isolation device and methodMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 0949US8105131B2Method and apparatus for removing material from microfeature workpiecesKISTLER RODNEY C·Filed 2009·Granted Jan 31, 2012·0 cites·20 claims
- 1048US8610280B2Platinum-containing constructions, and methods of forming platinum-containing constructionsZAGREBELNY ANDREY V·Filed 2011·Granted Dec 17, 2013·0 cites·28 claims
- 1146US9401285B2Chemical mechanical planarization topography control via implantMICRON TECHNOLOGY INC·Filed 2014·Granted Jul 26, 2016·0 cites·25 claims
- 1243US2009056744A1Wafer cleaning compositions and methodsMICRON TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 1341US9153451B2Method of forming a planar surface for a semiconductor device structure, and related methods of forming a semiconductor device structureMICRON TECHNOLOGY INC·Filed 2012·Granted Oct 6, 2015·0 cites·22 claims
- 1440US2015044783A1Methods of alleviating adverse stress effects on a wafer, and methods of forming a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2013·Application pending·0 cites
- 1534US2013313718A1Substrates Comprising Integrated Circuitry, Methods Of Processing A Substrate Comprising Integrated Circuitry, And Methods Of Back-Side Thinning A Substrate Comprising Integrated CircuitryVARGHESE SONY·Filed 2012·Application pending·0 cites
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