Inventor · disambiguated record
Tzong-Hann Yang
Also filed as: YANG TZONG-HANN
8 granted patents·12 citations·filing 2011–2019
80Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD4CHENG MING-DA1LAI CHIH-WEI1LIM ZHENG-YI1TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
8 records- 0185US9430605B2Adjusting sizes of connectors of package componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 30, 2016·4 cites·20 claims
- 0279US8791579B2Adjusting sizes of connectors of package componentsLAI CHIH-WEI·Filed 2011·Granted Jul 29, 2014·6 cites·17 claims
- 0373US10483230B2Bonding package components through platingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 19, 2019·1 cites·19 claims
- 0468US9691738B2Bonding package components through platingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 27, 2017·1 cites·20 claims
- 0563US10840212B2Bonding package components through platingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 17, 2020·0 cites·20 claims
- 0656US9111064B2Adjusting sizes of connectors of package componentsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 18, 2015·0 cites·20 claims
- 0751US9117772B2Bonding package components through platingLIM ZHENG-YI·Filed 2012·Granted Aug 25, 2015·0 cites·21 claims
- 0844US8501615B2Metal bump formationCHENG MING-DA·Filed 2011·Granted Aug 6, 2013·0 cites·19 claims
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