Inventor · disambiguated record
Scott Lefevre
Also filed as: LEFEVRE SCOTT · LEFEVRE SCOTT W
9 granted patents·6 pending applications·9 citations·filing 2013–2024
78Inventor score
Files withTOKYO ELECTRON LTD15
Top patents by PatentIndex Score
15 records- 0184US9054050B2Method for deep silicon etching using gas pulsingTOKYO ELECTRON LTD·Filed 2013·Granted Jun 9, 2015·7 cites·14 claims
- 0277US10971372B2Gas phase etch with controllable etch selectivity of Si-containing arc or silicon oxynitride to different films or masksTOKYO ELECTRON LTD·Filed 2016·Granted Apr 6, 2021·2 cites·17 claims
- 0361US11538691B2Gas phase etch with controllable etch selectivity of Si-containing arc or silicon oxynitride to different films or masksTOKYO ELECTRON LTD·Filed 2021·Granted Dec 27, 2022·0 cites·16 claims
- 0458US11380554B2Gas phase etching system and methodTOKYO ELECTRON LTD·Filed 2020·Granted Jul 5, 2022·0 cites·16 claims
- 0553US12461034B2In-situ fluorescence-based chamber and wafer monitoringTOKYO ELECTRON LTD·Filed 2023·Granted Nov 4, 2025·0 cites·21 claims
- 0653US12308250B2Pre-etch treatment for metal etchTOKYO ELECTRON LTD·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 0752US2024395557A1Systems and methods for semiconductor etchingTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0852US2024243006A1Systems and methods for bonding semiconductor devicesTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0952US2025226208A1Methods for protecting a peripheral edge and backside of a semiconductor substrateTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1051US11626271B2Surface fluorination remediation for aluminium oxide electrostatic chucksTOKYO ELECTRON LTD·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 1150US2024194478A1Apparatus and methods for processing bonding semiconductor wafersTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1248US10580660B2Gas phase etching system and methodTOKYO ELECTRON LTD·Filed 2016·Granted Mar 3, 2020·0 cites·15 claims
- 1347US8962067B2Real time process control of the polymer dispersion indexTOKYO ELECTRON LTD·Filed 2013·Granted Feb 24, 2015·0 cites·18 claims
- 1447US2024170444A1Bonding layer and processTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1545US2025239457A1Tungsten-based additive for through-substrate etchingTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
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