Inventor · disambiguated record
Qian Fan
Also filed as: FAN QIAN · FAN QIAN-FENG
25 granted patents·2 pending applications·47 citations·filing 2012–2024
92Inventor score
Files withSUZHOU HAN HUA SEMICONDUCTOR CO LTD14OSTENDO TECHNOLOGIES INC6GUANGDONG MIDEA CONSUMER ELECTRIC MFG CO LTD3COGNEX VISION INSPECTION SYSTEM SHANGHAI CO LTD1EL-GHOROURY HUSSEIN S1
Top patents by PatentIndex Score
27 records- 0194US8912017B2Semiconductor wafer bonding incorporating electrical and optical interconnectsEL-GHOROURY HUSSEIN S·Filed 2012·Granted Dec 16, 2014·24 cites·11 claims
- 0287US11602243B2Food processorGUANGDONG MIDEA CONSUMER ELECTRIC MFG CO LTD·Filed 2019·Granted Mar 14, 2023·8 cites·7 claims
- 0386US9306116B2Semiconductor wafer bonding incorporating electrical and optical interconnectsOSTENDO TECHNOLOGIES INC·Filed 2014·Granted Apr 5, 2016·6 cites·88 claims
- 0477US9978582B2Methods for improving wafer planarity and bonded wafer assemblies made from the methodsOSTENDO TECHNOLOGIES INC·Filed 2016·Granted May 22, 2018·3 cites·20 claims
- 0574US10622456B2Semiconductor device and method for manufacturing the sameSUZHOU HAN HUA SEMICONDUCTOR CO LTD·Filed 2019·Granted Apr 14, 2020·1 cites·14 claims
- 0673US10777653B2Method for manufacturing an integrated enhancement/depletion mode HEMTSUZHOU HAN HUA SEMICONDUCTOR CO LTD·Filed 2019·Granted Sep 15, 2020·1 cites·8 claims
- 0773US10727053B2Method of fabricating semiconductor structureSUZHOU HAN HUA SEMICONDUCTOR CO LTD·Filed 2019·Granted Jul 28, 2020·1 cites·9 claims
- 0872US11538963B1III-V light emitting device having low Si—H bonding dielectric layers for improved P-side contact performanceOSTENDO TECHNOLOGIES INC·Filed 2019·Granted Dec 27, 2022·2 cites·20 claims
- 0970US10786117B2Food processorGUANGDONG MIDEA CONSUMER ELECTRIC MFG CO LTD·Filed 2019·Granted Sep 29, 2020·1 cites·20 claims
- 1066US11495714B2Device and method for III-V light emitting micropixel array device having hydrogen diffusion barrier layerOSTENDO TECHNOLOGIES INC·Filed 2021·Granted Nov 8, 2022·0 cites·7 claims
- 1165US12472710B2Microlens arrays and method for fabricating the sameSUZHOU HAN HUA SEMICONDUCTOR CO LTD·Filed 2024·Granted Nov 18, 2025·0 cites·12 claims
- 1265US11056572B2Semiconductor device and method for manufacturing the sameSUZHOU HAN HUA SEMICONDUCTOR CO LTD·Filed 2020·Granted Jul 6, 2021·0 cites·8 claims
- 1363US11049952B2Integrated enhancement/depletion mode HEMTSUZHOU HAN HUA SEMICONDUCTOR CO LTD·Filed 2020·Granted Jun 29, 2021·0 cites·18 claims
- 1462US2025248089A13d micro-curved epitaxial structure and preparation methodSUZHOU HAN HUA SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 1561US11532739B2Integrated enhancement/depletion mode HEMT and method for manufacturing the sameSUZHOU HAN HUA SEMICONDUCTOR CO LTD·Filed 2020·Granted Dec 20, 2022·0 cites·19 claims
- 1658US11476390B2III-V light emitting device with pixels enabling lower cost through-layer viasOSTENDO TECHNOLOGIES INC·Filed 2021·Granted Oct 18, 2022·0 cites·12 claims
- 1758US10784366B2Integrated enhancement/depletion mode HEMT and method for manufacturing the sameSUZHOU HAN HUA SEMICONDUCTOR CO LTD·Filed 2019·Granted Sep 22, 2020·0 cites·10 claims
- 1856US12015246B2Vertical cavity surface emitting laser and corresponding fabricating methodSuzhou hanhua semiconductor co ltd·Filed 2021·Granted Jun 18, 2024·0 cites·19 claims
- 1955US11195975B2Device and method for III-V light emitting micropixel array device having hydrogen diffusion barrier layerOSTENDO TECHNOLOGIES INC·Filed 2019·Granted Dec 7, 2021·0 cites·23 claims
- 2053US10879063B2Method for fabricating high-quality and high-uniformity III-nitride epi structureSUZHOU HAN HUA SEMICONDUCTOR CO LTD·Filed 2019·Granted Dec 29, 2020·0 cites·17 claims
- 2153US10763174B2Method for recovering carbon-face-polarized silicon carbide substrateSUZHOU HAN HUA SEMICONDUCTOR CO LTD·Filed 2019·Granted Sep 1, 2020·0 cites·8 claims
- 2250US11974698B2Food processor, and power supply board assembly and base for food processorGUANGDONG MIDEA CONSUMER ELECTRIC MFG CO LTD·Filed 2018·Granted May 7, 2024·0 cites·6 claims
- 2348US10777654B2Method for manufacturing nitrogen-face polarity gallium nitride epitaxial structureSUZHOU HAN HUA SEMICONDUCTOR CO LTD·Filed 2019·Granted Sep 15, 2020·0 cites·8 claims
- 2447US2025139785A1Easy line finder based on dynamic time warping methodCOGNEX VISION INSPECTION SYSTEM SHANGHAI CO LTD·Filed 2022·Application pending·0 cites
- 2546US11049943B2Method for forming III-nitride semiconductor device and the III-nitride semiconductor deviceSUZHOU HAN HUA SEMICONDUCTOR CO LTD·Filed 2018·Granted Jun 29, 2021·0 cites·9 claims
- 2642US11049718B2Fabrication of group III-nitride semiconductor devicesSUZHOU HAN HUA SEMICONDUCTOR CO LTD·Filed 2019·Granted Jun 29, 2021·0 cites·17 claims
- 2741US10749020B2Group III-nitride semiconductor device and corresponding fabricating methodSUZHOU HAN HUA SEMICONDUCTOR COLTD·Filed 2019·Granted Aug 18, 2020·0 cites·20 claims
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