Inventor · disambiguated record
Sang-Ran Koh
Also filed as: KOH SANG-RAN
17 granted patents·8 pending applications·30 citations·filing 2007–2019
89Inventor score
Top patents by PatentIndex Score
25 records- 0188US8524851B2Silicon-based hardmask composition and process of producing semiconductor integrated circuit device using the sameKIM SANG KYUN·Filed 2010·Granted Sep 3, 2013·13 cites·15 claims
- 0273US8344075B2Hybrid siloxane polymer, encapsulant obtained from the siloxane polymer, and electronic device including the encapsulantCHEIL IND INC·Filed 2011·Granted Jan 1, 2013·2 cites·13 claims
- 0372US8273519B2Hardmask composition and associated methodsKIM MI YOUNG·Filed 2007·Granted Sep 25, 2012·4 cites·10 claims
- 0470US8877877B2Polyorganosiloxane, encapsulation material obtained from the polyorganosiloxane, and electronic device including the encapsulation materialKOH SANG-RAN·Filed 2011·Granted Nov 4, 2014·5 cites·11 claims
- 0567US9291899B2Resist underlayer composition and method of manufacturing semiconductor integrated circuit device using the sameCHO HYEON-MO·Filed 2009·Granted Mar 22, 2016·2 cites·13 claims
- 0667US9140986B2Resist underlayer composition and process of producing integrated circuit devices using the sameKIM MI-YOUNG·Filed 2012·Granted Sep 22, 2015·2 cites·11 claims
- 0763US8512870B2Transparent resin for encapsulation material and electronic device including the sameSHIN JUNE-HO·Filed 2012·Granted Aug 20, 2013·1 cites·17 claims
- 0855US8847414B2Resin for transparent encapsulation material, and associated encapsulation material and electronic deviceCHA SUNG-HWAN·Filed 2011·Granted Sep 30, 2014·1 cites·17 claims
- 0948US2015376453A1Organic polysiloxane composition, encapsulant, and electronic deviceSAMSUNG SDI CO LTD·Filed 2014·Application pending·0 cites
- 1047US8916329B2Hardmask composition and associated methodsKIM SANG KYUN·Filed 2009·Granted Dec 23, 2014·0 cites·18 claims
- 1146US9147626B2Resin for transparent encapsulation material, and associated encapsulation material and electronic deviceCHA SUNG-HWAN·Filed 2014·Granted Sep 29, 2015·0 cites·17 claims
- 1245US2015041959A1Hardmask composition for forming resist underlayer film, process for producing a semiconductor integrated circuit device, and semiconductor integrated circuit deviceSAMSUNG SDI CO LTD·Filed 2014·Application pending·0 cites
- 1344US8758981B2Photoresist underlayer composition and method of manufacturing semiconductor device by using the sameKIM MI-YOUNG·Filed 2012·Granted Jun 24, 2014·0 cites·15 claims
- 1442US9441111B2Composition for encapsulant, encapsulant, and electronic elementCHEIL IND INC·Filed 2013·Granted Sep 13, 2016·0 cites·9 claims
- 1541US2010167212A1Resist underlayer composition and method of manufacturing integrated circuit device using the sameCHO HYEON-MO·Filed 2009·Application pending·0 cites
- 1640US11608471B2Composition for etching silicon nitride film and etching method using sameSAMSUNG SDI CO LTD·Filed 2019·Granted Mar 21, 2023·0 cites·16 claims
- 1740US8455605B2Resin composition for transparent encapsulation material and electronic device formed using the sameKOH SANG-RAN·Filed 2012·Granted Jun 4, 2013·0 cites·20 claims
- 1839US10020185B2Composition for forming silica layer, silica layer, and electronic deviceSAMSUNG SDI CO LTD·Filed 2015·Granted Jul 10, 2018·0 cites·16 claims
- 1938US9657143B2Curable polysiloxane composition for optical device and encapsulant and optical deviceCHEIL IND INC·Filed 2013·Granted May 23, 2017·0 cites·9 claims
- 2034US2012168815A1Encapsulation material and electronic device prepared using the sameKOH SANG-RAN·Filed 2011·Application pending·0 cites
- 2134US2011241175A1Hardmask composition for forming resist underlayer film, process for producing a semiconductor integrated circuit device, and semiconductor integrated circuit deviceKOH SANG RAN·Filed 2011·Application pending·0 cites
- 2234US2012270143A1Resist underlayer composition and method of manufacturing semiconductor integrated circuit devices using the sameYUN HUI-CHAN·Filed 2012·Application pending·0 cites
- 2333US9695287B2Curable organo polysiloxane composition, encapsulant, and electronic deviceSAMSUNG SDI CO LTD·Filed 2015·Granted Jul 4, 2017·0 cites·14 claims
- 2433US2012029157A1Modified siloxane polymer composition, encapsulant obtained from the modified siloxane polymer composition, and electronic device including the encapsulantKIM WOO-HAN·Filed 2011·Application pending·0 cites
- 2531US2016172188A1Rinse solution for silica thin film, method of producing silica thin film, and silica thin filmSAMSUNG SDI CO LTD·Filed 2015·Application pending·0 cites
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